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IS42S16800B の電気的特性と機能

IS42S16800BのメーカーはISSIです、この部品の機能は「8Meg x16 128-MBIT SYNCHRONOUS DRAM」です。


製品の詳細 ( Datasheet PDF )

部品番号 IS42S16800B
部品説明 8Meg x16 128-MBIT SYNCHRONOUS DRAM
メーカ ISSI
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IS42S16800B Datasheet, IS42S16800B PDF,ピン配置, 機能
IS42S81600B
IS42S16800B
16Meg x 8, 8Meg x16
128-MBIT SYNCHRONOUS DRAM
ISSI®
MAY 2006
FEATURES
• Clock frequency: 167, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42S81600B
VDD VDDQ
3.3V 3.3V
IS42S16800B
3.3V 3.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
www.DataSheet4U.com Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh with programmable refresh periods
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Industrial Temperature Availability
• Lead-free Availability
OVERVIEW
ISSI's 128Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock
input.The 128Mb SDRAM is organized as follows.
IS42S81600B
4M x8x4 Banks
54-pin TSOPII
IS42S16800B
2M x16x4 Banks
54-pin TSOPII
KEY TIMING PARAMETERS
Parameter
-6 -7 -75E
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
67
10 7.5
Clk Frequency
CAS Latency = 3
CAS Latency = 2
167 143
100 133
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
5.4
5.4
6
6
Unit
ns
ns
Mhz
Mhz
ns
ns
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. E
05/01/06
1

1 Page





IS42S16800B pdf, ピン配列
IS42S81600B, IS42S16800B
PIN CONFIGURATIONS
54 pin TSOP - Type II for x8
ISSI ®
www.DataSheet4U.com
VDD
DQ0
VDDQ
NC
DQ1
VSSQ
NC
DQ2
VDDQ
NC
DQ3
VSSQ
NC
VDD
NC
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54 VSS
53 DQ7
52 VSSQ
51 NC
50 DQ6
49 VDDQ
48 NC
47 DQ5
46 VSSQ
45 NC
44 DQ4
43 VDDQ
42 NC
41 VSS
40 NC
39 DQM
38 CLK
37 CKE
36 NC
35 A11
34 A9
33 A8
32 A7
31 A6
30 A5
29 A4
28 VSS
PIN DESCRIPTIONS
A0-A11
A0-A9
BA0, BA1
DQ0 to DQ7
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQM
VDD
Vss
VDDQ
VssQ
NC
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. E
05/01/06
Write Enable
Data Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
3


3Pages


IS42S16800B 電子部品, 半導体
IS42S81600B, IS42S16800B
ISSI ®
GENERAL DESCRIPTION
READ
The READ command selects the bank from BA0, BA1
inputs and starts a burst read access to an active row.
Inputs A0-A9 (x8); A0-A8 (x16) provides the starting column
location. When A10 is HIGH, this command functions as an
AUTO PRECHARGE command. When the auto precharge
is selected, the row being accessed will be precharged at
the end of the READ burst. The row will remain open for
subsequent accesses when AUTO PRECHARGE is not
selected. DQ’s read data is subject to the logic level on the
DQM inputs two clocks earlier. When a given DQM signal
was registered HIGH, the corresponding DQ’s will be High-
Z two clocks later. DQ’s will provide valid data when the
DQM signal was registered LOW.
WRITE
A burst write access to an active row is initiated with the
WRITE command. BA0, BA1 inputs selects the bank, and
the starting column location is provided by inputs A0-A9
(x8); A0-A8 (x16). Whether or not AUTO-PRECHARGE is
used is determined by A10.
The row being accessed will be precharged at the end of the
WRITEwww.DataSheet4U.com burst, if AUTO PRECHARGE is selected. If AUTO
PRECHARGE is not selected, the row will remain open for
subsequent accesses.
A memory array is written with corresponding input data on
DQ’s and DQM input logic level appearing at the same time.
Data will be written to memory when DQM signal is LOW.
When DQM is HIGH, the corresponding data inputs will be
ignored, and a WRITE will not be executed to that byte/
column location.
PRECHARGE
The PRECHARGE command is used to deactivate the open
row in a particular bank or the open row in all banks. BA0,
BA1 can be used to select which bank is precharged or they
are treated as “Don’t Care”. A10 determined whether one or
all banks are precharged. After executing this command,
the next command for the selected bank(s) is executed after
passage of the period t , which is the period required for
RP
bank precharging. Once a bank has been precharged, it is
in the idle state and must be activated prior to any READ or
WRITE commands being issued to that bank.
AUTO PRECHARGE
The AUTO PRECHARGE function ensures that the precharge
is initiated at the earliest valid stage within a burst. This
function allows for individual-bank precharge without requir-
ing an explicit command. A10 to enable the AUTO
PRECHARGE function in conjunction with a specific READ
or WRITE command. For each individual READ or WRITE
command, auto precharge is either enabled or disabled.
AUTO PRECHARGE does not apply except in full-page
burst mode. Upon completion of the READ or WRITE burst,
a precharge of the bank/row that is addressed is automati-
cally performed.
AUTO REFRESH COMMAND
This command executes the AUTO REFRESH operation.
The row address and bank to be refreshed are automatically
generatedduringthisoperation. Thestipulatedperiod(tRC)is
required for a single refresh operation, and no other com-
mands can be executed during this period. This command is
executed at least 4096 times for every 64ms. During an
AUTO REFRESH command, address bits are “Don’t Care”.
This command corresponds to CBR Auto-refresh.
BURST TERMINATE
The BURST TERMINATE command forcibly terminates the
burst read and write operations by truncating either fixed-
length or full-page bursts and the most recently registered
READ or WRITE command prior to the BURST TERMI-
NATE.
COMMAND INHIBIT
COMMAND INHIBIT prevents new commands from being
executed. Operations in progress are not affected, apart
from whether the CLK signal is enabled
NO OPERATION
When CS is low, the NOP command prevents unwanted
commands from being registered during idle or wait states.
LOAD MODE REGISTER
During the LOAD MODE REGISTER command the mode
register is loaded from A0-A11. This command can only be
issued when all banks are idle.
ACTIVE COMMAND
When the ACTIVE COMMAND is activated, BA0, BA1
inputs selects a bank to be accessed, and the address
inputs on A0-A11 selects the row. Until a PRECHARGE
command is issued to the bank, the row remains open for
accesses.
6 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. E
05/01/06

6 Page



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共有リンク

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