|
|
Número de pieza | IRLR8503PBF | |
Descripción | HEXFET Power MOSFET | |
Fabricantes | International Rectifier | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de IRLR8503PBF (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! www.DataSheet4U.com
IRLR850P3D-P95b09F5A
IRLR8503PbF
• N-Channel Application-Specific MOSFET
• Ideal for CPU Core DC-DC Converters
• Low Conduction Losses
• Minimizes Parallel MOSFETs for high current
applications
• Lead-Free
HEXFET® MOSFET for DC-DC Converters
D
Description
This new device employs advanced HEXFET Power
MOSFET technology to achieve very low on-resistance.
The reduced conduction losses makes it ideal for high
efficiency DC-DC converters that power the latest
generation of microprocessors.
G
S D-Pak
The IRLR8503 has been optimized and is 100% tested for
all parameters that are critical in synchronous buck
icnodnuvceertdertsurinn-colundiinmgmRuDnSi(toyn.),
gate
The
charge and Cdv/dt-
IRLR8503 offers an
eloxstsreems ienlycolonwtrocl oFmETbianpaptiolicnaotiof nQss.w & RDS(on) for reduced
The package is designed for vapor phase, infra-red,
convection, or wave soldering techniques. Power
dissipation of greater than 2W is possible in a typical PCB
mount application.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (VGS ≥ 10V)
Pulsed Drain Current
TC = 25°C
TC = 90°C
Power Dissipation
TC = 25°C
TC = 90°C
Junction & Storage Temperature Range
Continuous Source Current (Body Diode)
Pulsed source Current
Thermal Resistance
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
www.irf.com
Symbol
VDS
VGS
ID
IDM
PD
TJ, TSTG
IS
ISM
Symbol
RθJA
RθJL
DEVICE RATINGS (MAX. Values)
IRLR8503PbF
VDS
RDS(on)
QG
Qsw
Qoss
30V
18 mΩ
20 nC
8 nC
29.5 nC
IRLR8503
30
±20
44
32
196
62
30
–55 to 150
15
196
Units
V
A
W
°C
A
Max.
50
2.0
Units
°C/W
°C/W
1
12/06/04
1 page 2.5
ID = 15A
VGS = 4.5V
2.0
1.5
1.0
IRLR8503PbF
Typical Characteristics
IRLR8503
6.0
ID= 15A
VDS = 20V
4.0
2.0
0.5
-60 -40 -20 0 20 40 60 80 100 120 140 160
TJ , Junction Temperature ( °C )
Figure 8. Normalized On-Resistance vs. Temperature
0.015
0.014
0.013
0.0
0
4 8 12
QG, Total Gate Charge (nC)
16
Figure 9. Gate-to-Source Voltage vs. Typical Gate
Charge
2500
2000
1500
VCCCGirossssSss
= 0V,
=
=
=
CCCggdsds
f = 1MHz
+ Cgd , Cds
+ Cgd
SHORTED
Ciss
0.012
0.011
ID = 15A
0.010
3.0
4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0
VGS, Gate -to -Source Voltage (V)
Figure 10. Typical Rds(on) vs. Gate-to-Source Voltage
100 1000.0
1000
Coss
500
0
1
Crss
10
VDS , Drain-to-Source Voltage (V)
100
Figure 11. Typical Capacitance vs. Drain-to-Source Voltage
www.irf.com
100.0 TJ = 150°C
10.0
TJ = 25°C
VDS = 15V
20µs PULSE WIDTH
1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VGS, Gate-to-Source Voltage (V)
Figure 12. Typical Transfer Characteristics
5
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet IRLR8503PBF.PDF ] |
Número de pieza | Descripción | Fabricantes |
IRLR8503PBF | HEXFET Power MOSFET | International Rectifier |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |