PDF IRF1312 Data sheet ( Hoja de datos )

Número de pieza	IRF1312
Descripción	(IRF1312x) HEXFET Power MOSFET
Fabricantes	International Rectifier
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No Preview Available ! www.DataSheet4U.com Applications l High frequency DC-DC converters l Motor Control l Uninterrutible Power Supplies PD- 94504 IRF1312 IRF1312S IRF1312L HEXFET® Power MOSFET VDSS 80V RDS(on) max 10mΩ ID 95A Benefits l Low Gate-to-Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) l Fully Characterized Avalanche Voltage and Current TO-220AB IRF1312 D2Pak IRF1312S TO-262 IRF1312L Absolute Maximum Ratings ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C VGS dv/dt TJ TSTG Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torqe, 6-32 or M3 screw Max. 95 67 380 3.8 210 1.4 ± 20 5.1 -55 to + 175 300 (1.6mm from case ) 10 lbf•in (1.1N•m) Units A W W/°C V V/ns °C Thermal Resistance RθJC RθCS RθJA RθJA Parameter Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Junction-to-Ambient (PCB mount) Notes through are on page 11 www.irf.com Typ. ––– 0.50 ––– ––– Max. 0.73 ––– 62 40 Units °C/W 1 7/01/02 1 page IRF1312/S/L 100 LIMITED BY PACKAGE 80 60 40 20 0 25 50 75 100 125 150 TC , Case Temperature (°C) 175 Fig 9. Maximum Drain Current Vs. Case Temperature 1 VDS VGS RG RD D.U.T. VGS Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % +-VDD Fig 10a. Switching Time Test Circuit VDS 90% 10% VGS td(on) tr td(off) tf Fig 10b. Switching Time Waveforms D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01 0.01 0.00001 SINGLE PULSE (THERMAL RESPONSE) 0.0001 0.001 t1, Rectangular Pulse Duration (sec) P DM t1 t2 Notes: 1. Duty factor D = t1/ t 2 2. Peak T J = P DM x Z thJC + T C 0.01 0.1 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com 5 5 Page IRF1312/S/L D2Pak Tape & Reel Information TRR 1.60 (.063) 1.50 (.059) 4.10 (.161) 3.90 (.153) 1.60 (.063) 1.50 (.059) 0.368 (.0145) 0.342 (.0135) FEED DIRECTION 1.85 (.073) 1.65 (.065) TRL 10.90 (.429) 10.70 (.421) 11.60 (.457) 11.40 (.449) 15.42 (.609) 15.22 (.601) 1.75 (.069) 1.25 (.049) 16.10 (.634) 15.90 (.626) 24.30 (.957) 23.90 (.941) 4.72 (.136) 4.52 (.178) FEED DIRECTION 13.50 (.532) 12.80 (.504) 27.40 (1.079) 23.90 (.941) 4 330.00 (14.173) MAX. 60.00 (2.362) MIN. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. 26.40 (1.039) 24.40 (.961) 3 30.40 (1.197) MAX. 4 Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Starting TJ = 25°C, L = 0.15mH RG = 25Ω, IAS = 57A. (See Figure 12) ISD ≤ 57A, di/dt ≤ 410A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C Pulse width ≤ 400µs; duty cycle ≤ 2%. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. This is only applied to TO-220AB package This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. TO-220AB package is not recommended for Surface Mount Application Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.7/02 www.irf.com 11 11 Page

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