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Número de pieza | IRF7475PBF | |
Descripción | HEXFET Power MOSFET | |
Fabricantes | International Rectifier | |
Logotipo | ||
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IRF7475PbF
Applications
l High Frequency Point-of-Load
Synchronous Buck Converter for
Applications in Networking &
Computing Systems.
l Lead-Free
VDSS
12V
S
Benefits
l Very Low RDS(on) at 4.5V VGS
l Ultra-Low Gate Impedance
l Fully Characterized Avalanche Voltage
and Current
S
S
G
HEXFET® Power MOSFET
RDS(on) max
Qg
:15m @VGS = 4.5V 19nC
AA
1 8D
2 7D
3 6D
4 5D
Top View
SO-8
Absolute Maximum Ratings
Parameter
VDS Drain-to-Source Voltage
VGS
ID @ TA = 25°C
ID @ TA = 100°C
IDM
PD @TA = 25°C
PD @TA = 70°C
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V
cContinuous Drain Current, VGS @ 10V
Pulsed Drain Current
gPower Dissipation
gPower Dissipation
TJ
TSTG
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Thermal Resistance
Parameter
fRθJL Junction-to-Drain Lead
RθJA Junction-to-Ambient
Notes through are on page 10
www.irf.com
Max.
12
± 12
11
7.0
88
2.5
1.6
0.02
-55 to + 150
Units
V
A
W
W/°C
°C
Typ.
–––
–––
Max.
20
50
Units
°C/W
1
09/21/04
1 page IRF7475PbF
12 1.6
9 1.4
ID = 250µA
6 1.2
3 1.0
0
25 50 75 100 125
TC , Case Temperature ( °C)
Fig 9. Maximum Drain Current Vs.
Case Temperature
150
0.8
-75 -50 -25 0 25 50 75 100 125 150
TJ, Temperature (°C)
Fig 10. Threshold Voltage Vs. Temperature
100
D = 0.50
10 0.20
0.10
0.05
0.02
1
0.01
0.1
0.00001
PDM
t1
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.0001
0.001
Notes:
1. Duty factor D = t1 / t 2
2. Peak TJ = P DM x Z thJA + TA
0.01 0.1
1
t1 , Rectangular Pulse Duration (sec)
10
100
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
5
5 Page |
Páginas | Total 10 Páginas | |
PDF Descargar | [ Datasheet IRF7475PBF.PDF ] |
Número de pieza | Descripción | Fabricantes |
IRF7475PBF | HEXFET Power MOSFET | International Rectifier |
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