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PDF SX16A-3-5SA Data sheet ( Hoja de datos )

Número de pieza SX16A-3-5SA
Descripción SIP Non-Isolated Power Module
Fabricantes Bourns Electronic 
Logotipo Bourns Electronic Logotipo



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Features
SIP (Single in-line package)
Output voltage programmable from
0.75 Vdc to 3.3 Vdc via external resistor
Up to 16 A output current
Up to 95 % efficiency
Small size, low profile, cost-efficient open
frame design
Low output ripple and noise
High reliability
Remote on/off
Remote sense
Output overcurrent protection
(non-latching)
Overtemperature protection
Constant switching frequency (300 kHz)
Wide operating temperature range
Optional sequencing function
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Description
Bourns® SX(T)16A-3-5SA is a non-isolated DC-DC converter
offering designers a cost and space-efficient solution with
standard features such as remote on/off, remote sense, precisely
regulated programmable output voltage, overcurrent and over-
temperature protection, and optional output voltage sequencing.
These modules deliver up to 16 A of output current with full load
efficiency of 95 % at 3.3 V output.
Absolute Maximum Ratings
How to Order
S X (T) 16A - 3-5 S A (-P)
Configuration
S = SIP
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
S = Single
Output Voltage (V)*
A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if
exposed to absolute maximum ratings for extended time periods.
Characteristic
Continuous Input Voltage
Operating Temperature Range
Storage Temperature
Sequencing Function
Min.
-0.3
-40
-55
-0.3
Max.
5.8
+85
+125
Vin, max.
Units
Vdc
°C
°C
Vdc
Notes & Conditions
See Thermal Considerations section
Electrical Specifications
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic
Operating Input Voltage
Maximum Input Current
Input No Load Current
Input Stand-by Current
Inrush Transient
Input Reflected Ripple Current
Input Ripple Rejection
Min.
2.4
-
Nom.
Max.
5.5
16.0
25
30
1.5
0.1
100
30
Units
Vdc
Adc
mA
mA
mA
A2s
mAp-p
dB
Notes & Conditions
Vout Vin - 0.5 V
Over Vin range, Io max, Vout = 3.3 Vdc
Vin = 5.0 Vdc, Io = 0 A, mod. enabled,
-Vout = 0.75 Vdc
-Vout = 3.3 Vdc
Vin = 5.0 Vdc, module disabled
120 Hz
Caution: The power modules are not internally fused. An external input line fast acting fuse with a maximum rating of 20 A (glass type,
rated to 32V) is required. See the Safety Considerations section of this data sheet.
Applications
Intermediate Bus architecture
Distributed power applications
Workstations and servers
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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SX16A-3-5SA pdf
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-0.5
Iin, Adc
Vo, Vdc
0.5 1.5 2.5 3.5 4.5 5.5
Input Voltage (Vdc )
Fig. 7 Input Voltage vs. Io and Vo
(Vo= 2.5 V, Io= 16.0 A)
Output Voltage: 200 mVolt 5 µs
Output Current (5.0 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Fig. 10 Transient Response - 8 A - 16 A Step
(Vo = 3.3 Vdc )
?
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Time (2.5 µs/div)
Fig. 8 Typical Output Ripple and Noise
(V in= 5.0 V, V o = 0.75 V, I o= 16.0 A)
?
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Time (2.5 µs/div)
Fig. 9 Typical Output Ripple and Noise
(Vin = 5.0 V, Vo = 3.3 V, Io = 16.0 A)
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Voltage: 200 mVolt 5 µs
Output Current (5.0 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Fig. 11 Transient Response - 16 A - 8 A Step
(Vo = 3.3 Vdc )
?
Output Voltage: 100 mVolt 10 µs
Output Current (5.0 A/Div): 2 Volt 10 µs
Time (10 µs/div)
Fig. 12 Transient Response - 8 A - 16 A Step
(Vo= 3.3 Vdc, Cext = 3x100 µF Polymer Capacitors)
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SX16A-3-5SA arduino
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
Vo: 1 Volt 500 µs
Vseq: 1 Volt 500 µs
Time (0.5 ms/div)
Fig. 27 Voltage Sequencing at Power Up
(V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Vo: 1 Volt 1 ms
Vseq: 1 Volt 1 ms
Time (0.5 ms/div)
Fig. 28 Voltage Sequencing at Power Down
(V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Remote Sense
The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See
Figure 29). The voltage between the Sense pin and Vo pin must not exceed 0.5 V.
When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module.
It is very important to make sure that the maximum output power (Vo x Io) of the module remains less than or equal to the maximum
rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.
Rdistribution Rcontact
VIN(+) Vo
Sense
Rcontact Rdistribution
RLOAD
Rdistribution Rcontact
COM
Rcontact Rdistribution
Fig. 29 Remote Sense Circuit Configuration
Thermal Considerations
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.
The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in
Figure 31.
The thermal reference points are (1) Tref1 and Tref2 as shown in Figure 30, and (2) Tref3 = temperature at controller IC. For reliable
operation, none of these Tref points should exceed 115 °C.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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