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PDF UMZ1NT1 Data sheet ( Hoja de datos )

Número de pieza UMZ1NT1
Descripción Complementary Dual General Purpose Amplifier Transistor
Fabricantes ON Semiconductor 
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UMZ1NT1
Complementary Dual
General Purpose
Amplifier Transistor
PNP and NPN Surface Mount
Features
High Voltage and High Current: VCEO = 50 V, IC = 200 mA
High hFE: hFE = 200X400
Moisture Sensitivity Level: 1
ESD Rating − Human Body Model: 3A
ESD Rating − Machine Model: C
Pb−Free Package is Available
http://onsemi.com
(6) (5) (4)
Q1 Q2
(1) (2)
(3)
MAXIMUM RATINGS (TA = 25°C)
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Collector Current − Continuous
THERMAL CHARACTERISTICS
Symbol
V(BR)CBO
V(BR)CEO
V(BR)EBO
IC
Value
Unit
60 Vdc
50 Vdc
7.0 Vdc
200www.DataShemet4AU.dcocm
Characteristic
(One Junction Heated)
Total Device Dissipation
TA = 25°C
Derate above 25°C
Symbol
PD
Max
187 (Note 1)
256 (Note 2)
1.5 (Note 1)
2.0 (Note 2)
Unit
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
RqJA
670 (Note 1) °C/W
490 (Note 2)
Characteristic
(Both Junctions Heated)
Total Device Dissipation
TA = 25°C
Derate above 25°C
Symbol
PD
Max
250 (Note 1)
385 (Note 2)
2.0 (Note 1)
3.0 (Note 2)
Unit
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
RqJA
493 (Note 1) °C/W
325 (Note 2)
Thermal Resistance, Junction-to-Lead
RqJL
188 (Note 1) °C/W
208 (Note 2)
Junction and Storage Temperature
TJ, Tstg − 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 x 1.0 inch Pad
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 5
1
SC−88
CASE 419B
MARKING DIAGRAM
3Z M G
G
1
3Z = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device*
Package
Shipping
UMZ1NT1
SC−88
3000 / Tape & Reel
UMZ1NT1G
SC−88
3000 / Tape & Reel
(Pb−Free)
*The “T1” suffix refers to a 7 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
UMZ1NT1/D

1 page




UMZ1NT1 pdf
UMZ1NT1
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
e
654
HE −E−
123
b 6 PL
0.2 (0.008) M E M
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.80 0.95 1.10 0.031 0.037 0.043
A1 0.00 0.05 0.10 0.000 0.002 0.004
A3 0.20 REF
0.008 REF
b 0.10 0.21 0.30 0.004 0.008 0.012
C 0.10 0.14 0.25 0.004 0.005 0.010
D 1.80 2.00 2.20 0.070 0.078 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 BSC
0.026 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 2.00 2.10 2.20 0.078 0.082 0.086
C
A
A1 L
SOLDERING FOOTPRINT*
0.50
0.0197
0.40
0.0157
0.65
0.025
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
5
UMZ1NT1/D

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