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USBULC6-2F3 の電気的特性と機能

USBULC6-2F3のメーカーはST Microelectronicsです、この部品の機能は「Dual ultra low capacitance protection」です。


製品の詳細 ( Datasheet PDF )

部品番号 USBULC6-2F3
部品説明 Dual ultra low capacitance protection
メーカ ST Microelectronics
ロゴ ST Microelectronics ロゴ 




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USBULC6-2F3 Datasheet, USBULC6-2F3 PDF,ピン配置, 機能
USBULC6-2F3
IPAD™
Dual ultra low capacitance protection for high speed USB
Main application
Hi-Speed USB port in wireless handsets (up to
480 Mb/s according to USB 2.0 High Speed
Specification)
Features
Ultra low diode capacitance (1.2 pF max)
Two data lines (D+ and D-) protected against
15 kV ESD
Breakdown Voltage VBR = 6.0 V min
Flip-Chip 400 µm pitch, lead-free
Very low leakage current
Very small PCB area
RoHS compliant
Flip-Chip
(4 Bumps)
Pin configuration (bump side)
AB
1
2
Description
www.DataSheet4U.com
The USBULC6-2F3 is a monolithic, application
specific discrete device dedicated to ESD
protection of high speed interfaces.
Its ultra low line capacitance secures a high level
of signal integrity without compromizing the
protection of downstream sensitive chips against
the most stringently characterized ESD strikes.
Configuration
A1
B1
Benefits
Minimized impact on rise and fall times for
maximum data integrity
Low PCB space occupation
Higher reliability offered by monolithic
integration
Complies with the following standards:
IEC 61000-4-2: 15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015.7
25 kV (Human body model)
A2 B2
Note: B1 and B2 bumps must be
grounded on the PCB together
Order code
Part Number
USBULC6-2F3
Marking
EH
TM: IPAD is a trademark of STMicroelectronics
December 2006
Rev 1
1/8
www.st.com

1 Page





USBULC6-2F3 pdf, ピン配列
USBULC6-2F3
Characteristics
Figure 2.
Eye diagram, board only (according Figure 3.
to USB High Speed)
Eye diagram, board with
USBULC6-2F3 (according to
USB 2.0 High Speed)
Board
480 Mb/s
USBULC6-2F3
480 Mb/s
Horiz: 350 ps/div
Ver: 200 mV/div
Horiz: 350 ps/div
Ver: 200 mV/div
Figure 4. ESD response to IEC 61000-4-2
(+15 kV air discharge)
Figure 5. ESD response to IEC 61000-4-2
(-15 kV air discharge
X: 50 ns/division
Y: 20 V/division
1 Gs/s
X: 50 ns/division
Y: 20 V/division
1 Gs/s
Figure 6. Junction capacitance versus
frequency (typical values)
C(pF)
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E+07
VOSC=30 mVRMS
Tj=25 °C
1.E+08
F(Hz)
1.E+09
Figure 7. Analog crosstalk measurements
dB
0.00
USBULC6 -2F3
-30.00
-60.00
-90.00
-120.00
100.0k
1.0M
F (Hz)
10.0M
100.0M
1.0G
3/8


3Pages


USBULC6-2F3 電子部品, 半導体
Package information
3 Package information
Figure 14. Flip-Chip dimensions
400 µm ± 40
USBULC6-2F3
605 µm ± 55
0.92 mm ± 30 µm 255 µm ± 40
Figure 15. Foot print recommendations Figure 16. Marking
Copper pad Diameter:
220µm recommended
260µm maximum
Solder mask opening:
300µm minimum
Solder stencil opening :
220µm recommended
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
6/8

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
USBULC6-2F3

Dual ultra low capacitance protection

ST Microelectronics
ST Microelectronics


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