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PDF CS8126 Data sheet ( Hoja de datos )
| Número de pieza | CS8126 | |
| Descripción | Low Dropout Linear Regulator | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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CS8126
5.0 V, 750 mA Low
Dropout Linear Regulator
with Delayed RESET
The CS8126 is a low dropout, high current 5.0 V linear regulator. It
is an improved replacement for the CS8156. Improvements include
higher accuracy, tighter saturation control, better supply rejection, and
enhanced RESET circuitry. Familiar PNP regulator features such as
reverse battery protection, overvoltage shutdown, thermal shutdown,
and current limit make the CS8126 suitable for use in automotive and
battery operated equipment. Additional on−chip filtering has been
included to enhance rejection of high frequency transients on all
external leads.
An active microprocessor RESET function is included on−chip with
externally programmable delay time. During power−up, or after
detection of any error in the regulated output, the RESET lead will
remain in the low state for the duration of the delay. Types of errors
include short circuit, low input voltage, overvoltage shutdown,
thermal shutdown, or others that cause the output to become
unregulated. This function is independent of the input voltage and will
function correctly with an output voltage as low as 1.0 V. Hysteresis is
included in both the reset and Delay comparators for enhanced noise
immunity. A latching discharge circuit is used to discharge the Delay
capacitor, even when triggered by a relatively short fault condition.
This circuit improves upon the commonly used SCR structure by
providing full capacitor discharge (0.2 V type).
Note: The CS8126 is lead compatible with the LM2927 and
LM2926.
Features
• Low Dropout Voltage (0.6 V at 0.5 A)
• 3.0% Output Accuracy
• Active RESET
• External RESET Delay for Reset
• Protection Circuitry
− Reverse Battery Protection
− +60 V, −50 V Peak Transient Voltage
− Short Circuit Protection
− Internal Thermal Overload Protection
• Pb−Free Packages are Available
http://onsemi.com
1
5
1
1
5
1
5
1
7
TO−220−5
T SUFFIX
CASE 314D
TO−220−5
TVA SUFFIX
CASE 314K
TO−220−5
THA SUFFIX
CASE 314A
Pin 1. VIN
2. VOUT
3. GND
4. Delay
5. RESET
TO−220−5
THE SUFFIX
CASE 314J
Pin
D2PAK−7
DPS SUFFIX
CASE 936AB
1. VIN
2. VOUT
3. VOUT(SENSE)
4. GND
5. Delay
6. RESET
7. NC
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 16
1
Publication Order Number:
CS8126/D
1 page  
CS8126
TYPICAL PERFORMANCE CHARACTERISTICS
RLOAD = 25 W
55
50
45 125°C
40
35
30
25°C
25
20
15
−40°C
10
5.0
0
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
VIN (V)
Figure 2. ICQ vs. VIN Over Temperature
120
110
100
90
80
70
60
50
40
30
20
10
0
0
Room Temp.
RLOAD = 6.67
RLOAD = 10
RLOAD = 25
RLOAD = NO LOAD
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
VIN (V)
Figure 3. ICQ vs. VIN Over RLOAD
RLOAD = 25 W
5.5
5.0
4.5
4.0
3.5
3.0
125°C
2.5
2.0
−40°C
1.5
1.0
0.5
0
0
25°C
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
VIN (V)
Figure 4. VOUT vs. VIN Over Temperature
Room Temp.
5.5
5.0
4.5
4.0 RLOAD = NO LOAD
3.5
RLOAD = 6.67
3.0
2.5
2.0
1.5
RLOAD = 10
1.0
0.5
0
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0
VIN (V)
8.0 9.0 10
Figure 5. VOUT vs. VIN Over RLOAD
100
VIN 6.0−26 V
80
60
40
20
0
−20
−40
−60
−80
−100
0
TEMP = 25°C
TEMP = 40°C
TEMP = 125°C
100 200 300 400 500 600 700 800
Output Current (mA)
Figure 6. Line Regulation vs. Output
Current Over Temperature
6.0
4.0
2.0
0
−2.0
−4.0
−6.0
−8.0
−10
−12
−14
0
TEMP = −40°C
TEMP = 25°C
VIN = 14 V
TEMP = 125°C
100 200 300 400 500 600 700 800
Output Current (mA)
Figure 7. Load Regulation vs. Output
Current Over Temperature
http://onsemi.com
5
5 Page 
B
−P−
Q
UA
G
5X D
0.014 (0.356) M T P M
CS8126
PACKAGE DIMENSIONS
TO−220−5
THA SUFFIX
CASE 314A−03
ISSUE E
OPTIONAL
CHAMFER
E
−T−
SEATING
PLANE
C
L
F
K
5X J
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.572 0.613 14.529 15.570
B 0.390 0.415 9.906 10.541
C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
F 0.570 0.585 14.478 14.859
G 0.067 BSC
1.702 BSC
J 0.015 0.025 0.381 0.635
K 0.730 0.745 18.542 18.923
L 0.320 0.365 8.128 9.271
Q 0.140 0.153 3.556 3.886
S 0.210 0.260 5.334 6.604
U 0.468 0.505 11.888 12.827
−Q−
U
B
A
12345
TO−220−5
THE SUFFIX
CASE 314J−01
ISSUE O
−T−
SEATING
PLANE
C
E
W
LF
D 5 PL
0.356 (0.014) M T Q M
JK
G −M−
S
0.102 (0.004)
−N−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
4. DIMENSIONS EXCLUSIVE OF MOLD FLASH
AND METAL BURRS.
5. FOOTPAD LENGTH MEASURED FROM LEAD
TIP WITH REFERENCE TO DATUM −M−.
6. COPLANARITY 0.004" MAX. REFERENCE TO
DATUM −N− STANDOFF HEIGHT 0.00 − 0.010".
INCHES
DIM MIN MAX
A 0.568 0.583
B 0.395 0.405
C 0.170 0.180
D 0.028 0.036
E 0.045 0.055
F 0.543 0.558
G 0.067 BSC
J 0.014 0.022
K 0.073 0.088
L 0.324 0.339
Q 0.146 0.156
S 0.000 0.010
U 0.460 0.475
W 5°
MILLIMETERS
MIN MAX
14.43 14.81
10.03 10.29
4.32 4.57
0.71 0.91
1.14 1.40
13.79 14.17
1.70 BSC
0.36 0.56
1.85 2.24
8.23 8.61
3.71 3.96
0.00 0.25
11.68 12.07
5°
http://onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet CS8126.PDF ] | |
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