DataSheet.jp

UPD784216 の電気的特性と機能

UPD784216のメーカーはNECです、この部品の機能は「Single Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD784216
部品説明 Single Chip Microcontrollers
メーカ NEC
ロゴ NEC ロゴ 




このページの下部にプレビューとUPD784216ダウンロード(pdfファイル)リンクがあります。

Total 70 pages

No Preview Available !

UPD784216 Datasheet, UPD784216 PDF,ピン配置, 機能
www.DataSheet4U.com
User’s Manual
µPD784216, 784216Y Subseries
8-/16-Bit Single-Chip Microcontrollers
Hardware
µPD784214
µPD784215
µPD784216
µPD78F4216
µPD784214Y
µPD784215Y
µPD784216Y
µPD78F4216Y
Document No. U12015EJ3V0UM00 (3rd edition)
Date Published July 1999 N CP(K)
1996, 1999
Printed in Japan

1 Page





UPD784216 pdf, ピン配列
www.DataSheet4U.com
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
IEBus is a trademark of NEC Corporation.
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation in the USA.
SPARCstation is a trademark of SPARC International, Inc. in the USA.
Solaris and SunOS are trademarks of Sun Microsystems Inc. in the USA.
HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Co. in the USA.
NEWS and NEWS-OS are trademarks of Sony Corporation.
Ethernet is a trademark of Xerox Corporation in the USA.
OSF/Motif is a trademark of the Open Software Foundation, Inc.
TRON is an acronym of The Realtime Operating system Nucleus.
ITRON is an abbreviation of Industrial TRON.
User’s Manual U12015EJ3V0UM00
3


3Pages


UPD784216 電子部品, 半導体
www.DataSheet4U.com
Major Revisions in This Edition (1/2)
Page
Throughout
p. 146
p. 148
p. 149
p. 151
p. 199
p. 204
p. 206
p. 221
p. 226
p. 228
p. 243
p. 248
p. 250
p. 261
p. 271
p. 283
p. 312
p. 320
p. 326
p. 339
p. 342
p. 345
p. 355
p. 378
Description
Change of status of following products from “under development” to “development completed”:
µPD784214, 784214Y
Change of package of µPD78F4216, 78F4216Y
from 100-pin plastic QFP (14 mm × 14 mm, resin thickness 1.45 mm)
to 100-pin plastic LQFP (14 mm × 14 mm, resin thickness 1.4 mm)
Change of connection method for TEST/VPP pin
Modification of the following in CHAPTER 6 REAL-TIME OUTPUT FUNCTIONS:
Figure 6-1 Block Diagram of Real-time Output Port
Figure 6-3 Format of Real-time Output Port Mode Register (RTPM)
Figure 6-4 Format of Real-time Output Port Control Register (RTPC)
6.5 Using this Function
Addition of Cautions to the following in CHAPTER 9 8-BIT TIMER/COUNTERS 1 AND 2:
9.4.1 Operation as interval timer (8-bit operation)
9.4.3 Operation as square wave output (8-bit resolution)
9.4.4 Operation as 8-bit PWM output
Addition of Cautions to the following in CHAPTER 10 8-BIT TIMER/COUNTERS 5 AND 6:
10.4.1 Operation as interval timer (8-bit operation)
10.4.3 Operation as square wave output (8-bit resolution)
10.4.4 Operation as 8-bit PWM output
Addition of Cautions to the following in CHAPTER 11 8-BIT TIMER/COUNTERS 7 AND 8:
11.4.1 Operation as interval timer (8-bit operation)
11.4.3 Operation as square wave output (8-bit resolution)
11.4.4 Operation as 8-bit PWM output
Modification of text in 12.4.1 Operation as watch timer in CHAPTER 12 WATCH TIMER
In CHAPTER 14 A/D CONVERTER:
Modification of Caution related to A/D conversion result register (ADCR) in 14.2 Configuration
Modification of text related to reading A/D conversion result register (ADCR) in 14.5 Cautions
In CHAPTER 17 ASYNCHRONOUS SERIAL INTERFACE/3-WIRE SERIAL I/O:
Modification of Caution related to procedure when transmitting using UART in 17.3.2 Asynchronous serial
interface (UART) mode
Modification of Figure 17-12 Block Diagram of 3-Wire Serial I/O Mode
Modification of Figure 18-1 Block Diagram of Clocked Serial Interface (in 3-Wire I/O Mode) in
CHAPTER 18 3-WIRE SERIAL I/O MODE
In CHAPTER 19 I2C BUS MODE (ONLY µPD784216Y SUBSERIES):
Addition of Caution related to description of bits 0 and 1 (SPT0, SPT1) in Figure 19-3. Format of I2C Bus
Control Register (IICC0)
Addition of Note related to bit 3 (TRC0) in Figure 19-4 Format of I2C Bus Status Register (IICS0)
Addition of Note related to bit 2 (DFC) in Figure 19-5 Format of Prescaler Mode Register for Serial
Clock (SPRM0)
Modification of description of master/slave-operation interrupt request timing in 19.5.7 I2C interrupt request
(INTIIC0)
Modification of values in Table 19-5 Wait Times
6 User’s Manual U12015EJ3V0UM00

6 Page



ページ 合計 : 70 ページ
 
PDF
ダウンロード
[ UPD784216 データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
UPD784214A

16-BIT SINGLE-CHIP MICROCONTROLLERS

NEC
NEC
UPD784214AGC

16-BIT SINGLE-CHIP MICROCONTROLLERS

NEC
NEC
UPD784214AGF

16-BIT SINGLE-CHIP MICROCONTROLLERS

NEC
NEC
UPD784214AY

16-BIT SINGLE-CHIP MICROCONTROLLERS

NEC
NEC


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap