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PDF HSML-C265 Data sheet ( Hoja de datos )
| Número de pieza | HSML-C265 | |
| Descripción | (HSMx-C265) AlInGaP chipLED | |
| Fabricantes | HP | |
| Logotipo |  |
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Preliminary Datasheet
Agilent AlInGaP chipLED
Package Dimensions
HSMX-C265
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Device Selection Guide
Part Number
HSMA-C265
HSMC-C265
HSML-C265
HSMT-C265
Color
Amber
Red
Orange
Deep Red
Parts Per Reel
3000
3000
3000
3000
Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the
product(s) at anytime.
1 page  
Figure 3: Tape Dimensions
END
START
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MINIMUM OF
230mm
(9.05in.) MAY
CONSIST OF
CARRIER
AND/OR
COVER TAPE
Figure 4: Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface Mounting SMT LED
Indicator Components.
Storage Condition : 5
to 30 OC @ 60%RH max.
Baking is required under
the condition :
a) the blue silica gel
indicator
becoming
white / transparent
color
b) the pack has been open
for more than 1 week
Baking recommended
condition : 60 ± 5 OC for
20 hrs
www.semiconductor.agilent.com
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
Revision Date: xx-xx-xxxx
Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the
product(s) at anytime.
5
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet HSML-C265.PDF ] | |
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