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UPD70F3313 の電気的特性と機能

UPD70F3313のメーカーはNEC Electronicsです、この部品の機能は「(UPD703313 / UPD70F3311) 32-Bit Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD70F3313
部品説明 (UPD703313 / UPD70F3311) 32-Bit Microcontrollers
メーカ NEC Electronics
ロゴ NEC Electronics ロゴ 




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UPD70F3313 Datasheet, UPD70F3313 PDF,ピン配置, 機能
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Preliminary User’s Manual
V850ES/KG1+
32-Bit Single-Chip Microcontrollers
Hardware
µPD703313
µPD703313Y
µPD70F3311
µPD70F3311Y
µPD70F3313
µPD70F3313Y
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Document No. U16894EJ1V0UD00 (1st edition)
Date Published March 2004 N CP(K)
DataSheet4UP.rcinotmed in Japan
2004
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UPD70F3313 pdf, ピン配列
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NOTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2 HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3 PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
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benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4 STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
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Purchase of NEC Electronics I2C components conveys a license under the Philips I2C Patent Rights to
use these components in an I2C system, provided that the system conforms to the I2C Standard
Specification as defined by Philips.
Caution: µPD70F3311, 70F3311Y, 70F3313, and 70F3313Y use SuperFlash® technology licensed from
Silicon Storage Technology, Inc.
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in
the United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
DataSheet4U.com SPARCstation is a trademark of SPARC International, Inc.
Preliminary User’s Manual U16894EJ1V0UD
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UPD70F3313 電子部品, 半導体
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PREFACE
Readers
This manual is intended for users who wish to understand the functions of the
V850ES/KG1+ and design application systems using these products.
Purpose
This manual is intended to give users an understanding of the hardware functions of the
V850ES/KG1+ shown in the Organization below.
Organization
This manual is divided into two parts: Hardware (this manual) and Architecture (V850ES
Architecture User’s Manual).
Hardware
Pin functions
CPU function
On-chip peripheral functions
Flash memory programming
Electrical specifications (target)
Architecture
Data types
Register set
Instruction format and instruction set
Interrupts and exceptions
Pipeline operation
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How to Read This Manual It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To find the details of a register where the name is known
Refer to APPENDIX DCaRtaESGhISeTeEt4RUI.NcDoEmX.
To understand the details of an instruction function
Refer to the V850ES Architecture User’s Manual.
Register format
The name of the bit whose number is in angle brackets (<>) in the figure of the
register format of each register is defined as a reserved word in the device file.
To understand the overall functions of the V850ES/KG1+
Read this manual according to the CONTENTS.
To know the electrical specifications of the V850ES/KG1+
Refer to CHAPTER 32 ELECTRICAL SPECIFICATIONS (TARGET).
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual. Note with
caution that if “xxx.yyy” is described as is in a program, however, the compiler/assembler
cannot recognize it correctly.
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共有リンク

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部品番号部品説明メーカ
UPD70F3311

(UPD703313 / UPD70F3311) 32-Bit Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3311Y

(UPD703313 / UPD70F3311) 32-Bit Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3313

(UPD703313 / UPD70F3311) 32-Bit Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3313Y

(UPD703313 / UPD70F3311) 32-Bit Microcontrollers

NEC Electronics
NEC Electronics


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