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IR2110C PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 IR2110C
部品説明 (IR2110C / IR2113C) High and Low Side Driver in Die Wafer Form
メーカ International Rectifier
ロゴ International Rectifier ロゴ 



Total 18 pages
		

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IR2110C Datasheet, IR2110C PDF,ピン配置, 機能
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Data Sheet No. PD65001
IR2110C/IR2113C
HIGH AND LOW SIDE DRIVER IN DIE WAFER FORM
Features
100 % Tested at Probec
Available in Chip Pack, Unsawn
Wafer,
Sawn
on
Film
d
Floating channel designed for bootstrap operation
Fully operational to +500V or +600V
Tolerant to negative transient voltage
dV/dt immune
Gate drive supply range from 10 to 20V
Undervoltage lockout for both channels
3.3V logic compatible
Separate logic supply range from 3.3V to 20V
Logic and power ground ±5V offset
CMOS Schmitt-triggered inputs with pull-down
Cycle by cycle edge-triggered shutdown logic
Matched propagation delay for both channels
Outputs in phase with inputs
Typical Connection
up to 500V or 600V
VDD
HIN
SD
LIN
VSS
VCC
HO
VDD
VB
HIN VS
SD
LIN VCC
VSS COM
LO
TO
LOAD
(Refer to the Die Outlines for correct pin configuration). This/These diagram(s) show electrical
connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
Note:
c This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized
processes. Due to restrictions in die level processing, die may not be equivalent to standard package products and are
therefore offered with a conditional performance guarantee.The above data sheet is based on IR sample testing under
certain predetermined and assumed conditions, and are provided for illustration purposes only. Customers are encouraged
to perform testing in actual proposed packaged and use conditions. IR die products are tested using IR-based quality
assurance procedures and are manufactured using IR’s established processes. Programs for customer-specified testing
are available upon request. IR has experienced assembly yields of generally 95% or greater for individual die; however,
customer’s results will vary. Estimates such as those described and set forth in this data sheet for semiconductor die will
vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an equivalent
basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable
standard terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale,
which are available upon request. For customers requiring a particular parameter to be guaranteed, special testing can be
carried out or product can be purchased as known good die.
d Part number shown is for die in wafer. Contact factory for these other options.
www.irf.com
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