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Datasheet WS59820 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | Category |
1 | WS59820 | CMOS / Bi-Directional Bus Interface Registers
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
| Waferscale Integration | cmos |
2 | WS59820B | CMOS / Bi-Directional Bus Interface Registers
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
| Waferscale Integration | cmos |
3 | WS59820BJ | CMOS / Bi-Directional Bus Interface Registers
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
www.DataSheet4U 4U.com
| Waferscale Integration | cmos |
WS5 Datasheet ( Hoja de datos ) - resultados coincidentes |
N.º | Número de pieza | Descripción | Fabricantes | |
1 | WS512K16-xxx | 512Kx16 SRAM MODULE White Electronic Designs
512Kx16 SRAM MODULE
FEATURES
Access Times 17, 20, 25, 35ns MIL-STD-883 Compliant Devices Available Packaging • 44 pin Ceramic SOJ (Package 102) • 44 lead Ceramic Flatpack (Package 209) Organized as two banks of 256Kx16 Data Byte Control: Lower Byte (LB#) = I/O1-8 Upper B White Electronic Designs Corporation | ||
2 | WS512K32 | 512K X 32 SRAM MODULE SMD 5962-94611 WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. 68 lea ETC | ||
3 | WS512K32-XXX | 512K X 32 SRAM MODULE SMD 5962-94611 WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns n Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. 68 lea ETC | ||
4 | WS512K32BV | 512Kx32 3.3V SRAM MODULE WS512K32BV-XXXE 512Kx32 3.3V SRAM MODULE
FEATURES
s Access Times of 15†, 17, 20ns s MIL-STD-883 Compliant Devices Available s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Pack ETC | ||
5 | WS512K32BV-XXXE | 512Kx32 3.3V SRAM MODULE WS512K32BV-XXXE 512Kx32 3.3V SRAM MODULE
FEATURES
s Access Times of 15†, 17, 20ns s MIL-STD-883 Compliant Devices Available s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402) • 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Pack ETC | ||
6 | WS512K32V | 512Kx32 SRAM 3.3V MODULE WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE
FEATURES
s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509)
PRELIMINARY*
s ETC | ||
7 | WS512K32V-XXX | 512Kx32 SRAM 3.3V MODULE WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE
FEATURES
s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509)
PRELIMINARY*
s ETC |
Esta página es del resultado de búsqueda del WS59820. Si pulsa el resultado de búsqueda de WS59820 se puede ver detalladamente sobre la hoja de datos, el circuito y la disposición de pin. |
Número de pieza | Descripción | Fabricantes | |
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