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HCC242 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 HCC242
部品説明 (HCC240 / HCC242) Surface Mount Optically Coupled Isolator
メーカ OPTEK Technologies
ロゴ OPTEK Technologies ロゴ 



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HCC242 Datasheet, HCC242 PDF,ピン配置, 機能
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Product Bulletin HCC240
September 1996
Surface Mount Optically Coupled Isolator
Types HCC240, HCC242, TX, TXV, ESA-XN
Features
Absolute Maximum Ratings (TA = 25o C unless otherwise noted)
Surface mountable on ceramic or
printed circuit board
Miniature package saves circuit board
area
Electrical performance similar to
4N22A and 4N24A
Hermetically sealed
Screened per MIL-PRF-19500 TX and
TXV equivalent levels or per ESA
5000(6)
Input-to-Output Isolation Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.0 kVDC(1)
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55o C to +125o C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65o C to +150o C
Soldering Temperature (vapor phase reflow for 30 sec.) . . . . . . . . . . . . . . . . . 215o C
Soldering Temperature (heated collet for 5 sec.) . . . . . . . . . . . . . . . . . . . . . . . 260o C
Input Diode
Forward DC Current (65o C below) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 V
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mW(2)
Output Phototransistor
Description
The HCC240 and HCC242 are optically
coupled isolators, consisting of a gallium
Continuous Collector Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V(3)
Emitter-Collector Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0 V(4)
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mW(5)
aluminum arsenide LED and a silicon
phototransistor mounted and coupled in
a miniature surface mount hermetic
leadless chip carrier. The HCC240 and
HCC242 are identical except for the DC
current transfer ratio. Electrical
Notes:
(1) Measured with inputs shorted together and outputs shorted together.
(2) Derate linearly 1.0 mW/o C above 65o C.
(3) HCC240HV and HCC242HV are available rated at 55 V minimum.
(4) HCC240HV and HCC242HV are available rated at 7.0 V minimim.
(5) Derate linearly 3.0 mW/o C above 25o C.
(6) Some deviations from ESA 5000 apply. See page 13-4 for details.
parameters are similar to the JEDEC
registered 4N22A and 4N24A. These
solid state couplers are ideal for designs
mwhere board space and device weight
oare important design considerations.
.cTypical screening and lot acceptance
tests are provided on page 13-4. The
Uburn-in condition is VCE = 9 V, PD = 275
t4mW, IF = 20-50 mA (adjusted to achieve
ePD). No HTRB is performed on this
edevice.
www.DataShOptek Technology, Inc. 1215 W. Crosby Road
Carrollton, Texas 75006
15-28
(972) 323-2200
Fax (972) 323-2396

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