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ABA-51563 の電気的特性と機能

ABA-51563のメーカーはHewlett-Packardです、この部品の機能は「3.5 GHz Broadband Silicon RFIC Amplifier」です。


製品の詳細 ( Datasheet PDF )

部品番号 ABA-51563
部品説明 3.5 GHz Broadband Silicon RFIC Amplifier
メーカ Hewlett-Packard
ロゴ Hewlett-Packard ロゴ 




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ABA-51563 Datasheet, ABA-51563 PDF,ピン配置, 機能
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Agilent ABA-51563
3.5 GHz Broadband Silicon
RFIC Amplifier
Data Sheet
Description
Agilent’s ABA-51563 is an
economical, easy-to-use, inter-
nally 50-ohm matched silicon
monolithic broadband amplifier
that offers excellent gain and flat
broadband response from DC to
3.5 GHz. Packaged in an ultra-
miniature industry-standard
SOT-363 package, it requires half
the board space of a SOT-143
package.
Surface Mount Package
SOT-363 /SC70
Pin Connections and
Package Marking
Features
• Operating frequency: DC ~ 3.5 GHz
• 21.5 dB gain
• VSWR < 2.0 throughout operating
frequency
• 1.8 dBm output P1dB
• 3.7 dB noise figure
• Unconditionally stable
• Single 5V supply (Id = 18 mA)
• Lead-free option available
Applications
• Amplifier for cellular, cordless,
special mobile radio, PCS, ISM,
wireless LAN, DBS, TVRO, and TV
tuner applications
At 2 GHz, the ABA-51563 offers a
small-signal gain of 21.5 dB,
output P1dB of 1.8 dBm and
11.4 dBm output third order
intercept point. It is suitable for
use as buffer amplifiers for
wideband applications. They are
designed for low cost gain blocks
in cellular applications, DBS
tuners, LNB and other wireless
communications systems.
ABA-51563 is fabricated using
Agilent’s HP25 silicon bipolar
process, which employs a double-
diffused single polysilicon
process with self-aligned submi-
cron emitter geometry. The
process is capable of simulta-
neous high fT and high NPN
breakdown (25 GHz fT at 6V
BVCEO). The process utilizes
industry standard device oxide
isolation technologies and
wswuwbm.DicarotnaSaluhmeientu4mUm.cuoltmilayer
interconnect to achieve superior
performance, high uniformity,
and proven reliability.
GND 1
GND 2
Input
Output
& Vcc
GND 3
Vcc
Note:
Top View. Package marking provides orientation
and identification. “x” is character to identify
date code.
Simplified Schematic
Vcc
RF
Input
Ground 2
Ground 3
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1A)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
RF
Output
& Vcc
Ground 1

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ABA-51563 pdf, ピン配列
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ABA-51563 Typical Performance
Tc = +25°C, Zo = 50, Vcc = 5V unless stated otherwise.
23 23
22 22
21 21
20 20
19
4.5V
5V
18 5.5V
17
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 2. Gain vs. Frequency and Voltage.
19
-40°C
+25°C
18 +85°C
17
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 3. Gain vs. Frequency and Temperature.
4.5
4
3.5
4.5V
5V
3 5.5V
2.5
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 4. Noise Figure vs. Frequency and
Voltage.
6
5
4
3
-40°C
+25°C
+85°C
2
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 5. Noise Figure vs. Frequency and
Temperature.
6
4
2
0
-2
4.5V
5V
-4 5.5V
-6
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 6. Output Power for 1 dB Gain
Compression vs. Frequency and Voltage.
6
4
2
0
-2
-40°C
+25°C
-4 +85°C
-6
0 0.5 1 1.5 2 2.5 3 3.5 4
FREQUENCY (GHz)
Figure 7. Output Power for 1 dB Gain
Compression vs. Frequency and Temperature.
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ABA-51563 電子部品, 半導体
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Device Models
Refer to Agilent’s web site
www.agilent.com/view/rf
Ordering Information
Part Number
Devices per Container
Container
ABA-51563-TR1
3000
7" reel
ABA-51563-TR2
10000
13" reel
ABA-51563-BLK
100
antistatic bag
ABA-51563-TR1G
3000
7" reel
ABA-51563-TR2G
10000
13" reel
ABA-51563-BLKG
100
antistatic bag
Note: For lead-free option,the part number will have the character Gat the end.
Package Dimensions
Outline 63 (SOT-363/SC-70)
Recommended PCB Pad Layout for
Agilent's SC70 6L/SOT-363 Products
0.026
HE E
e
D
A1
b
A2 A
Q1
L
0.039
0.079
0.018
Dimensions in inches.
c
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
DIMENSIONS (mm)
MIN.
MAX.
1.15 1.35
1.80 2.25
1.80 2.40
0.80 1.10
0.80 1.00
0.00 0.10
0.10 0.40
0.650 BCS
0.15 0.30
0.10 0.20
0.10 0.30
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
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部品番号部品説明メーカ
ABA-51563

3.5 GHz Broadband Silicon RFIC Amplifier

Hewlett-Packard
Hewlett-Packard
ABA-51563

3.5 GHz Broadband Silicon RFIC Amplifier

AVAGO
AVAGO


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