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PDF MRFIC1819 Data sheet ( Hoja de datos )
| Número de pieza | MRFIC1819 | |
| Descripción | GaAs Integrated Power Amplifier | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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( DataSheet : www.DataSheet4U.com )
3.6 V 18OO MHz GaAs
Integrated Power Amplifier
The MRFIC1819 is a single supply, RF power amplifier designed for the
1W DCS1800/PCS1900 handheld radio. The negative power supply is
generated inside the chip using RF rectification, which avoids any spurious
signal. A built in priority switch is provided to prevent Drain Voltage being
applied on the RF lineup if not properly biased by the Negative Voltage. The
device is packaged in the TSSOP–16EP package, with exposed backside
pad, which allows excellent electrical and thermal performance through a
solderable contact.
• Target 3.6 V Characteristics:
RF Input Power: 6.0 dBm
RF Output Power: 33 dBm Typical
Efficiency: 41% Typical
• Single Positive Supply Solution
• Negative Voltage Generator
• Positive Step–Up Voltage Generator
• VSS Check Switch for Gate–Drain Priority
Order this document by MRFIC1819/D
MRFIC1819
INTEGRATED RF
POWER AMPLIFIER
DCS1800/PCS1900
SEMICONDUCTOR
TECHNICAL DATA
16
1
PLASTIC PACKAGE
CASE 948L
(TSSOP–16EP, Tape and Reel Only)
PIN CONNECTIONS
Simplified Block Diagram
VD1 VD2 VD3
RF In
In Buf
Bias1
Bias2
Bias3
Negative
Voltage Generator
VD0 VDB
This device contains 9 active transistors.
www.DMaOtaTSOheReOt4ULA.coWmIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
RF Out
VSS
VP
VSC
VP 1
VD3 2
RFout 3
RFout 4
RFout 5
Bias3 6
Bias2 7
Bias1 8
16 VDB
15 VD0
14 InBuf
13 RFin
12 VD1
11 VD2
10 VSC
9 VSS
(Top View)
ORDERING INFORMATION
Device
Operating
Temp Range
Package
MRFIC1819R2 TA = –40 to 85°C wwTwS.SDOatPa–S1h6eEePt4U.com
© Motorola, Inc. 2000
Rev 3
1
1 page  
MRFIC1819
Figure 3. 3.6 V GSM & DCS IPA Dual–Band Application Circuit with Companion Chip & NMOS Switch
0V
TxEn
12
3.0 V
BS
8
0V
GSM
CE
3.0 V
DCS 7
Vbat
11
Vramp
1
0V
C5
10 µF
C39
0.1 µF
MC33170
Pin 1
A
B U1
6
5
3
C1
100 nF
R2 10 k
R5 0
R1
10 k
MTSF3N02HD
G
R11
10 k
A1
(Micro 8)
SD
Pin 1
2 4 10
2.0 V
50 Ω
In GSM
VD1 VD2
24
C7
10 nF
Zc = 50
C6
56 pF
C4
56 pF
Zc = 60 Ω
L = 3.0 mm
Zc = 60 Ω
L = 11 mm
C40
8.2 pF
L2
12 nH
L4
6.8 nH
VSS VDB
56
VP
3
C29
330 pF
9
10
11
12
MRFIC0919
13 TSSOP16EP
14
15
16
VD3
10
A
R13B 12 k
8
Gnd
9
C8
10 nF
8
7
6
5
4
3
2
1
R13C 12 k
R13A 6.8 k
C14
12 pF
C15
6.8 pF
C16
56 pF
Zc = 30 Ω
L = 7.0 mm
Zc = 50 Ω
50 Ω
Out GSM
Zc = 50 Ω
L = 17 mm
C12
4.7 pF
C17
56 pF
C8
10 nF
C25 10 nF
C11
56 pF
50 Ω
ID DCS
C34 47 pF
C35 22 pF
C41
47 nF
9
C36 22 pF
R10
Zc = 50 Ω 680 Ω
10
Zc = 60 Ω L = 3.0 mm 11
Zc = 60 Ω L = 3.0 mm 12
Zc = 50 Ω
L = 2.5 mm
C37 13
0.8 pF14
L10
1.8 nH
L = 4.5 mm
C24
22 pF
15
Zc = 80 Ω 16
L = 4.0 mm
L3
2.7 nH
L8 33 nH
C10
330 pF
C26
47 pF
MRFIC1819
TSSOP16EP
B
R13A 15 kΩ
8
R13B 15 kΩ
C42
8
R13C 7.5 kΩ
22 pF
7
6 C31 3.9 pF C32 1.0 pF
5
4
3 Zc = 30 Ω
L = 1.0 mm
2
Zc = 30 Ω
L = 1.0 mm
C9 22 pF
50 Ω
Out DCS
1 Zc = 50 Ω L = 17 mm
C22
2.7 pF
C33
22 pF
C30
10 nF
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
5
5 Page 
MRFIC1819
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 948L–01
(TSSOP–16EP)
ISSUE O
0.20 C B A
16X b REF
0.10 M C B S A S
2X E/2 16
9
E
EXPOSED THERMAL
PAD (BOTTOM SURFACE)
PIN 1
IDENTIFICATION
0.20 C B A
1
P1 E1
8
PB
DA
0.10 C
GAUGE PLANE
A
e
c
A1
R
N
0.25
N
Lq
DETAIL E
NOTES:
1 DIMENSIONS ARE IN MILLIMETERS.
2 INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3 DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15 PER
SIDE.
4 DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 PER
SIDE.
5 DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
DETAIL E
b
c1 b1
ÇÉÇÉÇÉc
ÇÇÉÇÇÉÇÇÉSECTION N–N
H
PARTING
LINE
MILLIMETERS
DIM MIN MAX
A ––– 1.20
A1 0.00 0.10
b 0.19 0.30
b1 0.19 0.25
c 0.09 0.20
c1 0.09 0.16
D 4.90 5.10
E 6.40 BSC
E1 4.30 4.50
e 0.65 BSC
L 0.50 0.75
P ––– 3.90
P1 ––– 3.00
R 0.18 0.28
q 0_ 8_
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MRFIC1819.PDF ] | |
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