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PDF MT48G16M16LF Data sheet ( Hoja de datos )

Número de pieza MT48G16M16LF
Descripción (MT48xx16M16LF) 4M x 16 x 4 Banks
Fabricantes Micron Technology 
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No Preview Available ! MT48G16M16LF Hoja de datos, Descripción, Manual

MOBILE SDRAM
PRELIMINARY
256Mb: x16
MOBILE SDRAM
MT48LC16M16LF, MT48G16M16LF,
MT48V16M16LF
4 MEG X 16 X 4 BANKS
Features
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, includes CONCURRENT AUTO
PRECHARGE and Auto Refresh Modes
• Self Refresh Mode
• 64ms, 8,192-cycle refresh
• LVTTL-compatible inputs and outputs
• Low voltage power supply
• Temperature Compensated Self Refresh (TCSR)
Option
VDD/VDDQ
Marking
3.3V/3.3V
3.0V/3.0V
LC
G
2.5V/2.5V-1.8V
• Configurations
16 Meg x 16 (4 Meg x 16 x 4 banks)
V
16M16
• Plastic Packages - OCPL
54-pin TSOP (400 mil)1
54-pin TSOP (400 mil) Lead-Free1
54-ball VFBGA (8mm x 14mm)2
54-ball VFBGA (8mm x 14mm) Lead-Free2
54-ball VFBGA (11mm x 8mm)2
54-ball VFBGA (11mm x 8mm) Lead-Free2
• Timing (Cycle Time)
TG
P
FG
BG
F8
B8
7.5ns @ CL = 3 (133MHz)
8.0ns @ CL = 3 (125 MHz)
-75
-8
9.6ns @ CL = 3 (104 MHz)
• Self Refresh
Standard
-10
None
• Operating Temperature
Commercial (0oC to + 70oC)
Extended (-25oC to + 75oC)
Industrial (-40oC to + 85oC)
None
XT
IT
NOTE:
1. Contact Factory for availability.
2. Due to space limitations, FBGA-packaged components have an
abbreviated part marking that is different from the part number.
For a quick conversion of an FBGA code, see the FBGA Part Marking
Decoder on the Micron web site, www.micron.com/decoder.
Figure 1: Ball Assignment (Top View)
54-Ball VFBGA
123456789
A VSS DQ15 VSSQ
VDDQ DQ0 VDD
B DQ14 DQ13 VDDQ
VSSQ DQ2 DQ1
C DQ12 DQ11 VSSQ
VDDQ DQ4 DQ3
D DQ10 DQ9 VDDQ
VSSQ DQ6 DQ5
E DQ8 NC
VSS
VDD LDQM DQ7
F UDQM CLK CKE
CAS\ RAS\ WE\
G A12 A11 A9
BA0 BA1 CS\
H A8 A7 A6
A0 A1 A10
J VSS A5 A4
A3 A2 VDD
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
16 Meg x 16
4 Meg x 16 x 4 banks
8K
8K (A0-A12)
4 (BA0, BA1)
512 (A0-A8)
Table 1: Key Timing Parameters
SPEED
CLOCK
GRADE FREQUENCY
ACCESS TIME1
CL=1 CL=2 CL=3
-75 133 MHz
-
- 5.4ns
-8 125 MHz
-
- 7ns
-10 104 MHz - 8ns 7ns
-75 104 MHz - 6ns -
-8 104 MHz - 8ns -
-10 83 MHz - 8ns -
-8
50 MHz 19ns
-
-
NOTE:
1. *CL = CAS (READ) latency
SETUP
TIME
1.5ns
2.5ns
2.5ns
1.5ns
2.5ns
2.5ns
2.5ns
HOLD
TIME
0.8ns
1.0ns
1.0ns
1.0ns
1.0ns
1.0ns
1.0ns
www.DataSheet4U.com
09005aef80737ef7
256Mbx16_1.fm - Rev. E 4/04 EN
1 ©2002 Micron Technology, Inc. All rights reserved.
wwPwR.ODDatUaCSThSeAetN4DU.ScPoEmCIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
www.DataSheet4U.com

1 page




MT48G16M16LF pdf
PRELIMINARY
256Mb: x16
MOBILE SDRAM
Figure 2: Pin Assignment (Top View) 54-Pin TSOP
x16
VDD
DQ0
VDDQ
DQ1
DQ2
VssQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VssQ
DQ7
VDD
DQML
WE#
CAS#
RAS#
CS#
BA0
BA1
A10
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
x16
54 Vss
53 DQ15
52 VssQ
51 DQ14
50 DQ13
49 VDDQ
48 DQ12
47 DQ11
46 VssQ
45 DQ10
44 DQ9
43 VDDQ
42 DQ8
41 Vss
40 NC
39 DQMH
38 CLK
37 CKE
36 A12
35 A11
34 A9
33 A8
32 A7
31 A6
30 A5
29 A4
28 Vss
09005aef80737ef7
256Mbx16_2.fm - Rev. E 4/04 EN
5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002 Micron Technology, Inc. All rights reserved.

5 Page





MT48G16M16LF arduino
CAS Latency
The CAS latency is the delay, in clock cycles,
between the registration of a READ command and the
availability of the first piece of output data. The latency
can be set to two or three clocks.
If a READ command is registered at clock edge n,
and the latency is m clocks, the data will be available
by clock edge n + m. The DQs will start driving as a
result of the clock edge one cycle earlier (n + m - 1),
and provided that the relevant access times are met,
the data will be valid by clock edge n + m. For example,
assuming that the clock cycle time is such that all rele-
vant access times are met, if a READ command is regis-
tered at T0 and the latency is programmed to two
clocks, the DQs will start driving after T1 and the data
will be valid by T2, as shown in Figure 6. Figure 4 indi-
cates the operating frequencies at which each CAS
latency setting can be used.
Figure 6: CAS Latency
T0 T1 T2 T3
CLK
T4 T5
COMMAND
READ
NOP
NOP
ADDRESS
BANK,
COL n
NOP READ NOP
X = 0 cycles
BANK,
COL b
DQ
DOUT
n
CAS Latency = 1
DOUT
n+1
DOUT
n+2
DOUT
n+3
DOUT
b
T0 T1 T2 T3
CLK
T4 T5
T6
COMMAND
READ
NOP
NOP
ADDRESS
BANK,
COL n
NOP READ NOP
X = 1 cycle
BANK,
COL b
NOP
DQ
DOUT
n
DOUT
n+1
DOUT
n+2
DOUT
n+3
DOUT
b
CAS Latency = 2
T0 T1 T2 T3
CLK
T4 T5
T6
T7
COMMAND
READ
NOP
NOP
ADDRESS
BANK,
COL n
DQ
CAS Latency = 3
NOP READ NOP NOP NOP
BANK,
COL b
X = 2 cycles
DOUT
n
DOUT
n+1
DOUT
n+2
DOUT
n+3
DOUT
b
TRANSITIONING DATA
DON’T CARE
NOTE: Each READ command may be to either bank.
DQM is LOW. BL=4
PRELIMINARY
256Mb: x16
MOBILE SDRAM
Reserved states should not be used as unknown
operation or incompatibility with future versions may
result.
Operating Mode
The normal operating mode is selected by setting
M7 and M8 to zero; the other combinations of values
for M7 and M8 are reserved for future use and/or test
modes. The programmed burst length applies to both
READ and WRITE bursts.
Test modes and reserved states should not be used
because unknown operation or incompatibility with
future versions may result.
Write Burst Mode
When M9 = 0, the burst length programmed via M0-
M2 applies to both READ and WRITE bursts; when M9
= 1, the programmed burst length applies to READ
bursts, but write accesses are single-location (non-
burst) accesses.
Table 4: CAS Latency
ALLOWABLE OPERATING FREQUENCY
(MHZ)
CAS
CAS
CAS
SPEED LATENCY = 1 LATENCY = 2 LATENCY = 3
- 75 -
104 133
- 8 50 104 125
- 10 40 83 104
09005aef80737ef7
256Mbx16_2.fm - Rev. E 4/04 EN
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002 Micron Technology, Inc. All rights reserved.

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