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HSMM-C190 の電気的特性と機能

HSMM-C190のメーカーはAgilent Technologiesです、この部品の機能は「(HSMx-C110/170/190/191/150) SMT Chip LED」です。


製品の詳細 ( Datasheet PDF )

部品番号 HSMM-C190
部品説明 (HSMx-C110/170/190/191/150) SMT Chip LED
メーカ Agilent Technologies
ロゴ Agilent Technologies ロゴ 




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HSMM-C190 Datasheet, HSMM-C190 PDF,ピン配置, 機能
www.DataSheet4U.comACSDa1Mg7tialT0e,SCnChthe1Hi9ep0StL,MECDM1s9/1Me, aNtn-4dCC1U1105,0.comDescription
These small chip-type LEDs utilize
ehigh efficient InGaN/SiC material to
deliver competitively priced high
hperformance blue and green. These
S525 nm green and 470 nm blue are
unique hues which provide color
tadifferentiation to a product.
These ChipLEDs come in either top
aemitting packages (HSMx-C170,
C190, C191, and C150) or in a side
.Demitting package (HSMx-C110).
The side emitting package is
especially suitable for LCD
backlighting application. The top
emitting packages with their wide
viewing angle are suitable for
direct backlighting application or
being used with light pipes. In
order to facilitate pick and place
operation, these ChipLEDs are
shipped in tape and reel with 4000
units per reel for HSMx-C170,
C190, and C191 packages, and
3000 units per reel for
HSMx-C110 and C150 packages.
All packages are compatible with
IR soldering and binned by both
color and intensity.
Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
wwDevice Selection Guide
mPackage Dimension (mm) [1], [2]
Ingan Green
Ingan Blue
w o1.6 (L) x 0.8 (W) x 0.6 (H)
HSMM-C191
HSMN-C191
.c1.6 (L) x 0.8 (W) x 0.8 (H)
HSMM-C190
HSMN-C190
t4U2.0 (L) x 1.25 (W) x 0.8 (H)
HSMM-C170
HSMN-C170
e3.2 (L) x 1.0 (W) x 1.5 (H)
HSMM-C110
HSMN-C110
he3.2 (L) x 1.6 (W) x 1.1 (H)
HSMM-C150
HSMN-C150
SNotes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
ataCAUTION: HSMM-C1xx and HSMN-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate
www.Dprecautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details.

1 Page





HSMM-C190 pdf, ピン配列
Package Dimensions, continued
LED DIE
CATHODE
MARK
3.2 (0.126 )
DIFFUSED
EPOXY
0.6 (0.024)
2.0 (0.079)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
1.6 (0.063)
0.8 (0.031)
POLARITY
1.1 (0.043)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C150
NOTES:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current [1]
Power Dissipation
Reverse Voltage (IR = 100 µA)
Led Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
HSMM-C110/C170/C190/C191/C150
HSMN-C110/C170/C190/C191/C150
20
78
5
95
–30 to +85
–40 to +85
See IR soldering profile (Figure 7)
Units
mA
mW
V
˚C
˚C
˚C
Electrical Characteristics at TA = 25˚C
Part Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ. Max.
HSMM-C110/C150
3.3 3.9
HSMN-C110/C150
3.3 3.9
HSMM-C170/C190/C191 3.3
3.9
HSMN-C170/C190/C191 3.3
3.9
VF Tolerance: ±0.1 V.
3
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
5
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
70
70
70
70
Thermal
Resistance
RθJ–PIN (˚C/W)
Typ.
450
450
300
300


3Pages


HSMM-C190 電子部品, 半導体
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
10 SEC. MAX.
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
–3°C/SEC. MAX.
Figure 7. Recommended reflow soldering profile.
0.9 (0.035)
5.0 (0.200)
0.9 (0.035)
0.2 (0.008)
1.5 2.0 1.5
(0.059) (0.079) (0.059)
1.0 (0.039)
CENTERING
BOARD
Figure 8. Recommended soldering pattern for HSMx-C110.
1.2 (0.047)
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 9. Recommended soldering pattern for HSMx-C170.
NOTE:
1. All dimensions in millimeters (inches).
6
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 10. Recommended soldering pattern
for HSMx-C190 and HSMx-C191.

6 Page



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共有リンク

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部品番号部品説明メーカ
HSMM-C190

(HSMx-C110/170/190/191/150) SMT Chip LED

Agilent Technologies
Agilent Technologies
HSMM-C191

(HSMx-C110/170/190/191/150) SMT Chip LED

Agilent Technologies
Agilent Technologies


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