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MC74AC139 の電気的特性と機能

MC74AC139のメーカーはON Semiconductorです、この部品の機能は「Dual 1-of-4 Decoder / Demultiplexer」です。


製品の詳細 ( Datasheet PDF )

部品番号 MC74AC139
部品説明 Dual 1-of-4 Decoder / Demultiplexer
メーカ ON Semiconductor
ロゴ ON Semiconductor ロゴ 




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MC74AC139 Datasheet, MC74AC139 PDF,ピン配置, 機能
MC74AC139, MC74ACT139
Dual 1-of-4
Decoder/Demultiplexer
The MC74AC139/74ACT139 is a high−speed, dual 1−of−4
decoder/demultiplexer. The device has two independent decoders,
each accepting two inputs and providing four mutually−exclusive
active−LOW outputs. Each decoder has an active−LOW Enable input
which can be used as a data input for a 4−output demultiplexer. Each
half of the MC74AC139/74ACT139 can be used as a function
generator providing four minterms of two variables.
Features
Multifunctional Capability
Two Completely Independent 1−of−4 Decoders
Active LOW Mutually Exclusive Outputs
Outputs Source/Sink 24 mA
ACT139 Has TTL Compatible Inputs
These are Pb−Free Devices
VCC Eb A0b A1b O0b O1b O2b O3b
16 15 14 13 12 11 10 9
12345678
Ea A0a A1a O0a O1a O2a O3a GND
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
PIN ASSIGNMENT
PIN FUNCTION
A0, A1
E
Address Inputs
Enable Inputs
O0−O3
Outputs
TRUTH TABLE
Inputs
E A0 A1 O0
HXX
LLL
LHL
LLH
LHH
H
L
H
H
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Outputs
O1 O2
HH
HH
LH
HL
HH
O3
H
H
H
H
L
www.onsemi.com
16
1
16
1
MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
1
xxx139G
AWLYWW
TSSOP−16
DT SUFFIX
CASE 948F
16
xxx
139
ALYWG
G
1
xxx = AC or ACT
A = Assembly Location
WL or L = Wafer Lot
Y = Year
WW or W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 8
1
Publication Order Number:
MC74AC139/D

1 Page





MC74AC139 pdf, ピン配列
MC74AC139, MC74ACT139
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VI
VO
IIK
IOK
IO
ICC
IGND
TSTG
TL
TJ
qJA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink/Source Current
DC Supply Current per Output Pin
DC Ground Current per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction temperature under Bias
Thermal Resistance (Note 2)
(Note 1)
SOIC
TSSOP
*0.5 to )7.0
*0.5 v VI v VCC )0.5
*0.5 v VO v VCC )0.5
$20
$50
$50
$50
$50
*65 to )150
260
)150
69.1
103.8
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
PD Power Dissipation in Still Air at 65°C (Note 3)
SOIC
TSSOP
500
500
mW
MSL
Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
Human Body Model (Note 4)
Machine Model (Note 5)
Charged Device Model (Note 6)
UL 94 V−0 @ 0.125 in
> 2000
> 200
> 1000
V
ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 7)
$100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. 500 mW at 65°C; derate to 300 mW by 10 mW/ from 65°C to 85°C.
4. Tested to EIA/JESD22−A114−A.
5. Tested to EIA/JESD22−A115−A.
6. Tested to JESD22−C101−A.
7. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min Typ Max Unit
VCC Supply Voltage
AC
ACT
2.0 5.0 6.0
V
4.5 5.0 5.5
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND)
0
VCC
V
tr, tf
Input Rise and Fall Time (Note 1)
AC Devices except Schmitt Inputs
VCC @ 3.0 V
150
VCC @ 4.5 V
40
− ns/V
VCC @ 5.5 V
25
tr, tf
Input Rise and Fall Time (Note 2)
ACT Devices except Schmitt Inputs
VCC @ 4.5 V
10
ns/V
VCC @ 5.5 V
8.0
TJ Junction Temperature (PDIP)
− − 140 °C
TA Operating Ambient Temperature Range
−40 25
85 °C
IOH Output Current − High
− − −24 mA
IOL Output Current − Low
− − 24 mA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
www.onsemi.com
3


3Pages


MC74AC139 電子部品, 半導体
MC74AC139, MC74ACT139
ORDERING INFORMATION
Device Order Number
Package
Shipping
MC74AC139DG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74AC139DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74AC139DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
MC74ACT139DG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74ACT139DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74ACT139DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
6

6 Page



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共有リンク

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