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MR18R326GAG0 の電気的特性と機能

MR18R326GAG0のメーカーはSamsung semiconductorです、この部品の機能は「(32Mx18) 16pcs RIMM Module based on 576Mb A-die」です。


製品の詳細 ( Datasheet PDF )

部品番号 MR18R326GAG0
部品説明 (32Mx18) 16pcs RIMM Module based on 576Mb A-die
メーカ Samsung semiconductor
ロゴ Samsung semiconductor ロゴ 




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MR18R326GAG0 Datasheet, MR18R326GAG0 PDF,ピン配置, 機能
MR18R326GAG0
Change History
Version 1.0 (Mar. 2004)
* First copy.
* Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMMModule Datasheet
Page 0
Version 1.0 Mar. 2004

1 Page





MR18R326GAG0 pdf, ピン配列
MR18R326GAG0
Pin
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
Pin Name
Gnd
LDQA8
Gnd
LDQA6
Gnd
LDQA4
Gnd
LDQA2
Gnd
LDQA0
Gnd
LCTMN
Gnd
LCTM
Gnd
NC
Gnd
LROW1
Gnd
LCOL4
Gnd
LCOL2
Gnd
LCOL0
Gnd
LDQB1
Gnd
LDQB3
Gnd
LDQB5
Gnd
LDQB7
Gnd
LSCK
Vcmos
SOUT
Vcmos
NC
Gnd
NC
Vdd
Vdd
NC
NC
NC
NC
Table 2: Module Pad Numbers and Signal Names
Pin
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
Pin Name
Gnd
LDQA7
Gnd
LDQA5
Gnd
LDQA3
Gnd
LDQA1
Gnd
LCFM
Gnd
LCFMN
Gnd
NC
Gnd
LROW2
Gnd
LROW0
Gnd
LCOL3
Gnd
LCOL1
Gnd
LDQB0
Gnd
LDQB2
Gnd
LDQB4
Gnd
LDQB6
Gnd
LDQB8
Gnd
LCMD
Vcmos
SIN
Vcmos
NC
Gnd
NC
Vdd
Vdd
NC
NC
NC
NC
Pin
A47
A48
A49
A50
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
Pin Name
NC
NC
NC
NC
Vref
Gnd
SCL
Vdd
SDA
SVdd
SWP
Vdd
RSCK
Gnd
RDQB7
Gnd
RDQB5
Gnd
RDQB3
Gnd
RDQB1
Gnd
RCOL0
Gnd
RCOL2
Gnd
RCOL4
Gnd
RROW1
Gnd
NC
Gnd
RCTM
Gnd
RCTMN
Gnd
RDQA0
Gnd
RDQA2
Gnd
RDQA4
Gnd
RDQA6
Gnd
RDQA8
Gnd
Pin
B47
B48
B49
B50
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
B70
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
B82
B83
B84
B85
B86
B87
B88
B89
B90
B91
B92
Pin Name
NC
NC
NC
NC
Vref
Gnd
SA0
Vdd
SA1
SVdd
SA2
Vdd
RCMD
Gnd
RDQB8
Gnd
RDQB6
Gnd
RDQB4
Gnd
RDQB2
Gnd
RDQB0
Gnd
RCOL1
Gnd
RCOL3
Gnd
RROW0
Gnd
RROW2
Gnd
NC
Gnd
RCFMN
Gnd
RCFM
Gnd
RDQA1
Gnd
RDQA3
Gnd
RDQA5
Gnd
RDQA7
Gnd
Page 2
Version 1.0 Mar. 2004


3Pages


MR18R326GAG0 電子部品, 半導体
MR18R326GAG0
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
U1
RDRAM Device(576Mb)
U2
RDRAM Device(576Mb)
U3
RDRAM Device(576Mb)
UN
RDRAM Device(576Mb)
Vdd
2 per
RDRAM device
0.22µF
Gnd
VREF
1 per
2 RDRAM devices
Plus one
Near Connector
0.22µF
Gnd
VCMOS
Gnd
1 per
2 RDRAM devices
0.22µF
Module
Capacity
1152MB
N
16
Note 1. RambusChannel signals form a loop through
the RIMM module, with the exception of the SIO chain.
Note 2. See Serial Presence Detection Specification for
information on the SPD device and its contents.
SVDD
SCL
SWP
47K
SA0
SA1
SA2
Serial Presence Detect
Vcc SVDD
SCL SDA
SDA
WP
U0A0 A1 A2
Gnd
0.22µF
Figure 2: RIMM Module Functional Diagram
Page 5
Version 1.0 Mar. 2004

6 Page



ページ 合計 : 14 ページ
 
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部品番号部品説明メーカ
MR18R326GAG0

(32Mx18) 16pcs RIMM Module based on 576Mb A-die

Samsung semiconductor
Samsung semiconductor


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