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PDF INF8574 Data sheet ( Hoja de datos )
| Número de pieza | INF8574 | |
| Descripción | Remote 8-Bit. I/O Expander for I2C Bus | |
| Fabricantes | IK Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de INF8574 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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m TECHNICAL DATA
et4U.co INF8574GENERAL DESCRIPTION
heThe INF8574 is a silicon CMOS circuit. It provides general purpose remote I/O expansion for most
Smicrocontroller families via the two-line bidirectional bus (I2C).
taThe device consists of an 8-bit quasi-bidirectional Port and an I2C interface. The INF8574 has a low current
aconsumption and includes latched outputs with high current drive capability for directly driving LEDs. It
.Dalso possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller.
wBy sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming
wdata on its ports without having to communicate via the I2C-bus. This means that the INF8574 can remain a
w simple slave device.
FEATURES
m Operating supply voltage 2.5 to 6 V
o Low standby current consumption of 10 A maximum
I2C to parallel port expander
.c Open-drain interrupt output
8-bit remote I/O Port for the I2C-bus
Compatible with most microcontrollers
U Latched outputs with high current drive capability for
t4directly driving LEDs
Address by 3 hardware address pins for use of up to 8
edevices (up to 16 with INF8574A)
DIP16, space-saving SO16 or SSOP20 package.
www.DataSheBLOCK DIAGRAM
www.DataSheet4U.com
1
1 page  
INF8574
WRITE mode (output Port).
5
5 Page 
INF8574
N SUFFIX PLASTIC DIP
(MS - 001BB)
A
16 9
B
18
FL
C
-T- SEATING
PLANE
N
G
KM
D
H
NOTES:
0.25 (0.010) M T
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
J
Symbol
A
B
C
D
F
G
H
J
K
L
M
N
Dimension, mm
MIN
18.67
MAX
19.69
6.1 7.11
5.33
0.36 0.56
1.14 1.78
2.54
7.62
0° 10°
2.92 3.81
7.62 8.26
0.2 0.36
0.38
D SUFFIX SOIC
(MS - 012AC)
A
16 9
H BP
1G
8
C
-T-
D
SEATING
K PLANE
J
0.25 (0.010) M T C M
R x 45
F
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
Symbol
A
B
C
D
F
G
MH
J
K
M
P
R
Dimension, mm
MIN MAX
9.8 10
3.8 4
1.35 1.75
0.33 0.51
0.4 1.27
1.27
5.72
0° 8°
0.1 0.25
0.19 0.25
5.8 6.2
0.25 0.5
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet INF8574.PDF ] | |
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