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UPD70F3114 の電気的特性と機能

UPD70F3114のメーカーはNEC Electronicsです、この部品の機能は「32-Bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD70F3114
部品説明 32-Bit Single-Chip Microcontrollers
メーカ NEC Electronics
ロゴ NEC Electronics ロゴ 




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UPD70F3114 Datasheet, UPD70F3114 PDF,ピン配置, 機能
User’s Manual
V850E/IA2TM
32-Bit Single-Chip Microcontrollers
Hardware
µPD703114
µPD70F3114
Document No. U15195EJ3V0UD00 (3rd edition)
Date Published December 2002 N CP(K)
Printed in Japan
2001

1 Page





UPD70F3114 pdf, ピン配列
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
V850 Series, V850E/IA1, and V850E/IA2 are trademarks of NEC Electronics Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or
other countries.
User’s Manual U15195EJ3V0UD
3


3Pages


UPD70F3114 電子部品, 半導体
Major Revisions in This Edition
Page
Description
Throughout
Addition of 100-pin plastic QFP (14 × 20) package
p. 26
Addition of Table 1-2 Differences Between V850E/IA1 and V850E/IA2 Register Setting Values
p. 82
Modification of description in 4.2.1 Pin status during internal ROM, internal RAM, and on-chip
peripheral I/O access
p. 84
Addition of Caution to 4.3.1 (1) Chip area select control registers 0, 1 (CSC0, CSC1)
p. 101
Modification and deletion of description in 4.9.1 Program space
p. 109
Addition of description to 6.3.1 (1) DMA source address registers 0H to 3H (DSA0H to DSA3H)
p. 111
Addition of description to 6.3.2 (1) DMA destination address registers 0H to 3H (DDA0H to
DDA3H)
p. 114
Addition of description and Caution to 6.3.4 DMA addressing control registers 0 to 3 (DADC0 to
DADC3)
p. 116
Addition of description and Caution to and modification of bit description in 6.3.5 DMA channel
control registers 0 to 3 (DCHC0 to DCHC3)
p. 117
Addition of description to 6.3.6 DMA disable status register (DDIS)
p. 117
Addition of description to 6.3.7 DMA restart register (DRST)
p. 126
Addition of Caution to 6.6.1 Two-cycle transfer
p. 130
Addition of description to Remark in 6.13 Forcible Termination
p. 130
Modification of description in 6.14 (3) Times related to DMA transfer
p. 146
Addition of Caution to 7.3.4 Interrupt control register (xxICn)
p. 150
Addition of Caution to 7.3.6 In-service priority register (ISPR)
p. 168
Modification of description in Figure 7-14 Pipeline Operation at Interrupt Request
Acknowledgement (Outline)
p. 196
Modification of description in Table 9-2 Operation Modes of Timer 0
p. 226
Modification of description in Table 9-4 Operation Modes Timer 0 (TM0n)
p. 227
Modification of description in Remark in 9.1.6 (2) PWM mode 0: Triangular wave modulation
(right-left symmetric waveform control)
pp. 230, 231, 233 to 238, Modification of Figures 9-15, 9-17 to 9-20, 9-22 to 9-30, and 9-32 to 9-35
242, 243, 245 to 260,
264, 265, 267 to 274
p. 395
Modification of maximum transfer rate in 10.2.1 Features
p. 422
Addition of description to Table 10-3 Baud Rate Generator Setting Data
p. 534
Addition of Caution to 12.2 (1) Functions of each port
p. 589
Addition of description to 15.2 (2) Off-board programming
p. 595
Addition of CHAPTER 16 ELECTRICAL SPECIFICATIONS
p. 619
Addition of CHAPTER 17 PACKAGE DRAWING
p. 621
Addition of CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS
p. 623
Addition of APPENDIX A NOTES ON TARGET SYSTEM DESIGN
p. 639
Modification of description in C.2 Instruction Set (Alphabetical Order)
p. 643
Addition of APPENDIX D INDEX
p. 651
Addition of APPENDIX E REVISION HISTORY
The mark shows major revised points.
6 User’s Manual U15195EJ3V0UD

6 Page



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部品番号部品説明メーカ
UPD70F3114

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3116

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics


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