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TE28F160B3 の電気的特性と機能

TE28F160B3のメーカーはIntel Corporationです、この部品の機能は「(TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory」です。


製品の詳細 ( Datasheet PDF )

部品番号 TE28F160B3
部品説明 (TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory
メーカ Intel Corporation
ロゴ Intel Corporation ロゴ 




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TE28F160B3 Datasheet, TE28F160B3 PDF,ピン配置, 機能
3 Volt Advanced Boot Block Flash
Memory
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Preliminary Datasheet
Product Features
s Flexible SmartVoltage Technology
— 2.7 V–3.6 V Read/Program/Erase
— 12 V VPP Fast Production Programming
s 2.7 V or 1.65 V I/O Option
— Reduces Overall System Power
s High Performance
— 2.7 V–3.6 V: 70 ns Max Access Time
s Optimized Block Sizes
— Eight 8-KB Blocks for Data,Top or
Bottom Locations
— Up to One Hundred Twenty-Seven 64-
KB Blocks for Code
s Block Locking
— VCC-Level Control through WP#
s Low Power Consumption
— 9 mA Typical Read Current
s Absolute Hardware-Protection
— VPP = GND Option
— VCC Lockout Voltage
s Extended Temperature Operation
— –40 °C to +85 °C
s Automated Program and Block Erase
— Status Registers
s Intel® Flash Data Integrator Software
— Flash Memory Manager
— System Interrupt Manager
— Supports Parameter Storage, Streaming
Data (e.g., Voice)
s Extended Cycling Capability
— Minimum 100,000 Block Erase Cycles
Guaranteed
s Automatic Power Savings Feature
— Typical ICCS after Bus Inactivity
s Standard Surface Mount Packaging
— 48-Ball CSP Packages
— 40- and 48-Lead TSOP Packages
s Density and Footprint Upgradeable for
common package
— 4-, 8-, 16-, 32- and 64-Mbit Densities
s ETOX™ VII (0.18 µ) Flash Technology
— 28F160/320/640B3xC
— 4-, 8-, 16-, and 32-Mbit also exist on
ETOX™ V (0.4µ) and/or ETOX ™ VI
(0.25µ) Flash Technology
s x8 not recommended for new designs
s 4-Mbit density not recommended for new
designs
The 3 Volt Advanced Boot Block flash memory, manufactured on Intel’s latest 0.18 µm
technology, represents a feature-rich solution at overall lower system cost. The 3 Volt Advanced
Boot Block flash memory products in x16 will be available in 48-lead TSOP and 48-ball CSP
packages. The x8 option of this product family will only be available in 40-lead TSOP and 48-
ball µBGA* packages. Additional information on this product family can be obtained by
accessing Intel’s website at: http://www.intel.com/design/flash.
t4u.comNotice: This document contains preliminary information on new products in production. The
e specifications are subject to change without notice. Verify with your local Intel sales office that
e you have the latest datasheet before finalizing a design.
tash Order Number: 290580-012
www.da October 2000

1 Page





TE28F160B3 pdf, ピン配列
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Contents
1.0 Introduction .................................................................................................................. 1
1.1 Product Overview .................................................................................................. 2
2.0 Product Description .................................................................................................. 3
2.1 Package Pinouts ................................................................................................... 3
2.2 Block Organization ................................................................................................ 7
2.2.1 Parameter Blocks ..................................................................................... 7
2.2.2 Main Blocks .............................................................................................. 7
3.0 Principles of Operation............................................................................................ 7
3.1 Bus Operation ....................................................................................................... 7
3.1.1 Read......................................................................................................... 8
3.1.2 Output Disable.......................................................................................... 8
3.1.3 Standby .................................................................................................... 8
3.1.4 Deep Power-Down / Reset.......................................................................8
3.1.5 Write ......................................................................................................... 9
3.2 Modes of Operation............................................................................................... 9
3.2.1 Read Array ............................................................................................... 9
3.2.2 Read Identifier ........................................................................................11
3.2.3 Read Status Register .............................................................................11
3.2.4 Program Mode........................................................................................12
3.2.5 Erase Mode ............................................................................................12
3.3 Block Locking ......................................................................................................14
3.3.1 WP# = VIL for Block Locking ..................................................................14
3.3.2 WP# = VIH for Block Unlocking ..............................................................15
3.4 VPP Program and Erase Voltages .......................................................................15
3.4.1 VPP = VIL for Complete Protection .........................................................15
3.5 Power Consumption ............................................................................................15
3.5.1 Active Power ..........................................................................................16
3.5.2 Automatic Power Savings (APS)............................................................16
3.5.3 Standby Power .......................................................................................16
3.5.4 Deep Power-Down Mode .......................................................................16
3.6 Power-Up/Down Operation .................................................................................16
3.6.1 RP# Connected to System Reset...........................................................17
3.6.2 VCC, VPP and RP# Transitions ...............................................................17
3.7 Power Supply Decoupling ...................................................................................17
4.0 Electrical Specifications........................................................................................18
4.1 Absolute Maximum Ratings.................................................................................18
4.2 Operating Conditions...........................................................................................19
4.3 Capacitance ........................................................................................................19
4.4 DC Characteristics ..............................................................................................20
4.5 AC Characteristics —Read Operations...............................................................23
4.6 AC Characteristics —Write Operations ...............................................................27
4.7 Program and Erase Timings................................................................................31
3UHOLPLQDU\
iii


3Pages


TE28F160B3 電子部品, 半導体
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Number
-008
-009
-010
-011
-012
Description
4-Mbit packaging and addressing information corrected throughout document
Corrected 4-Mbit memory addressing tables in Appendices D and E
Max ICCD changed to 25 µA
VCCMax on 32 M (28F320B3) changed to 3.3 V
Added 64-Mbit density and faster speed offerings
Removed access time vs. capacitance load curve
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate the affected product is the 0.25µm 32Mbit
device.
Minor text edits throughout document.
vi 3UHOLPLQDU\

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
TE28F160B3

(TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory

Intel Corporation
Intel Corporation
TE28F160B3-B120

SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

Intel Corporation
Intel Corporation
TE28F160B3-B150

SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

Intel Corporation
Intel Corporation
TE28F160B3-T120

SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

Intel Corporation
Intel Corporation


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