PDF MPC993 Data sheet ( Hoja de datos )

Número de pieza	MPC993
Descripción	Dynamic Switch PLL Clock Driver
Fabricantes	Motorola Semiconductors
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No Preview Available ! MOTOROLA SEMICONDUCTOR TECHNICAL DATA Dynamic Switch PLL Clock Driver MPC993 The MPC993 is a PLL clock driver designed specifically for redundant clock tree designs. The device receives two differential LVPECL clock signals from which it generates 5 new differential LVPECL clock outputs. Two of the output pairs regenerate the input signals frequency and phase while the other three pairs generate 2x, phase aligned clock outputs. External PLL feedback is used to also provide zero delay buffer performance. • Fully Integrated PLL • Intelligent Dynamic Clock Switch • LVPECL Clock Outputs • LVCMOS Control/Statis I/O • 3.3V Operation • 32–Lead TQFP Packaging • ±50ps Cycle–Cycle Jitter FA SUFFIX 32–LEAD PLASTIC TQFP PACKAGE CASE 751D–04 The MPC993 continuously monitors the two input signals to identify faulty reference clocks. Upon identification of a faulty input clock (input clock stuck HIGH or LOW for at least 3 feedback clock edges), an input bad flag will be set and the device will automatically switch from the bad reference clock input to the good one. During this dynamic switch of the input references, the MPC993 outputs will slew, with minimal period disturbances to the new phase. Sel_Clk CLK0 CLK0 CLK1 CLK1 Ext_FB Ext_FB MR Dynamic Switch Logic OR PLL_En PLL ÷2 ÷4 Figure 1. Block Diagram Qb0 Qb0 Qb1 Qb1 Qb2 Qb2 Qa0 Qa0 Qa1 Qa1 9/97 © Motorola, Inc. 1997 1 REV 0 1 page MPC993 A1 32 A OUTLINE DIMENSIONS FA SUFFIX PLASTIC TQFP PACKAGE CASE 873A–02 ISSUE A 4X 0.20 (0.008) AB T–U Z 25 1 –T– B B1 8 DETAIL Y –U– V 17 V1 9 –Z– 4X 9 S1 0.20 (0.008) AC T–U Z S –AB– SEATING PLANE –AC– G 0.10 (0.004) AC 8X M_ CE R DETAIL AD BASE METAL FÉÉÉÉNÉÉÉÉ D J SECTION AE–AE W H K X Q_ DETAIL AD AE P DETAIL Y AE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 7.000 BSC 0.276 BSC A1 3.500 BSC 0.138 BSC B 7.000 BSC 0.276 BSC B1 3.500 BSC 0.138 BSC C 1.400 1.600 0.055 0.063 D 0.300 0.450 0.012 0.018 E 1.350 1.450 0.053 0.057 F 0.300 0.400 0.012 0.016 G 0.800 BSC 0.031 BSC H 0.050 0.150 0.002 0.006 J 0.090 0.200 0.004 0.008 K 0.500 0.700 0.020 0.028 M 12_ REF 12_ REF N 0.090 0.160 0.004 0.006 P 0.400 BSC 0.016 BSC Q 1_ 5_ 1_ 5 _ R 0.150 0.250 0.006 0.010 S 9.000 BSC 0.354 BSC S1 4.500 BSC 0.177 BSC V 9.000 BSC 0.354 BSC V1 4.500 BSC 0.177 BSC W 0.200 REF 0.008 REF X 1.000 REF 0.039 REF ECLinPS and ECLinPS Lite DL140 — Rev 3 5 MOTOROLA 5 Page

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