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PDF 74145N Data sheet ( Hoja de datos )
| Número de pieza | 74145N | |
| Descripción | SN74145 | |
| Fabricantes | ETC | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de 74145N (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
Orderable Device
SNJ54LS145FK
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
LCCC
FK 20
1
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
POST-PLATE
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
SNJ54LS145J
SNJ54LS145W
ACTIVE
ACTIVE
CDIP
CFP
J 16 1
W 16 1
TBD
TBD
A42 N / A for Pkg Type -55 to 125
A42 N / A for Pkg Type -55 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
85084012A
SNJ54LS
145FK
8508401EA
SNJ54LS145J
8508401FA
SNJ54LS145W
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Samples
Addendum-Page 2
5 Page 
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet 74145N.PDF ] | |
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