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UC3610 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 UC3610
部品説明 Dual Schottky Diode Bridge
メーカ Unitrode
ロゴ Unitrode ロゴ 



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UC3610 Datasheet, UC3610 PDF,ピン配置, 機能
Dual Schottky Diode Bridge
UC1610
UC2610
UC3610
FEATURES
Monolithic Eight-Diode Array
Exceptional Efficiency
Low Forward Voltage
Fast Recovery Time
High Peak Current
Small Size
CONNECTION DIAGRAMS
DIL-8 (TOP VIEW)
N or J Package
DESCRIPTION
This eight-diode array is designed for high-current, low duty-cycle applications
typical of flyback voltage clamping for inductive loads. The dual bridge connection
makes this device particularly applicable to bipolar driven stepper motors.
The use of Schottky diode technology features high efficiency through lowered for-
ward voltage drop and decreased reverse recovery time.
This single monolithic chip is fabricated in both hermetic CERDIP and copper-
leaded plastic packages. The UC1610 in ceramic is designed for -55°C to +125°C
environments but with reduced peak current capability. The UC2610 in plastic and
ceramic is designed for -25°C to +125°C environments also with reduced peak
current capability; while the UC3610 in plastic has higher current rating over a 0°C
to +70°C temperature range.
ABSOLUTE MAXIMUM RATINGS
Peak Inverse Voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V
Peak Forward Current
UC1610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
UC3610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A
Power Dissipation at TA = +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Note: Consult Packaging Section of Databook for thermal limitations and considerations of
package.
SOIC-16 (TOP VIEW)
DW Package
PLCC-20 (TOP VIEW)
Q Package
3/95

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