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UPD78P078 の電気的特性と機能

UPD78P078のメーカーはNECです、この部品の機能は「8 Bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD78P078
部品説明 8 Bit Single-Chip Microcontrollers
メーカ NEC
ロゴ NEC ロゴ 




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UPD78P078 Datasheet, UPD78P078 PDF,ピン配置, 機能
User’s Manual
µPD78078, 78078Y Subseries
8-bit Single-chip Microcontrollers
µPD78076
µPD78078
µPD78P078
µPD78076Y
µPD78078Y
µPD78P078Y
Document No. U10641EJ4V0UM00 (4th edition)
Date Published December 1997 N
© 1994
Printed in Japan

1 Page





UPD78P078 pdf, ピン配列
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
FIP, EEPROM, IEBus, and QTOP are trademarks of NEC Corporation.
MS-DOS, Windows, and WindowsNT are either registered trademarks or trademarks of Microsoft
Corporation in the United States and/or other countries.
IBM DOS, IBM PC/AT, and PC DOS are trademarks of International Business Machines Corporation.
HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
Ethernet is a trademark of XEROX Corporation.
OSF/Motif is a trademark of Open Software Foundation, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
TRON is an abbreviation of The Realtime Operating System Nucleus.
ITRON is an abbreviation of Industrial TRON.
3


3Pages


UPD78P078 電子部品, 半導体
Major Revisions in This Edition
Page
Throughout
p. 139 to 143,
149, 153
p. 169
p. 181
p. 241
p. 262
p. 277
p. 316, 366
p. 323, 374
p. 372
p. 336
p. 449
p. 481
p. 482
p. 490
p. 491
p. 569
p. 597
p. 599 to 612
p. 613, 614
Description
The following products have been changed from “under development” to “already developed”.
µPD78078Y Subseries: µPD78076Y, 78078Y, 78P078Y
The following packages have been added to the µPD78078Y Subseries.
100-pin plastic LQFP (Fine pitch) (14 × 14 mm, resin thickness 1.4 mm)
Block diagrams of ports have been changed.
Figure 6-5. Block Diagram of P20, P21, P23 to P26, Figure 6-6. Block Diagram of P22 and P27,
Figure 6-7. Block Diagram of P20, P21, P23 to P26, Figure 6-8. Block Diagram of P22 and P27,
Figure 6-9. Block Diagram of P30 to P37, Figure 6-16. Block Diagram of P71 and P72,
Figure 6-20. Block Diagram of P100 and P101
Table 7-2. Relationship between CPU Clock and Minimum Instruction Execution Time has been
added.
8.1 Outline of Timers Incorporated into µPD78078, 78078Y Subseries has been added.
Figure 9-10. Square Wave Output Operation Timing has been added.
Figure 10-13. Square Wave Output Operation Timing has been added.
Figure 12-1. Block Diagram of Watchdog Timer has been corrected.
Precautions have been added to 17.1, 18.1 Serial Interface Channel 0 Functions.
Precautions have been added to 17.3 (2), 18.3 (2) Serial Operating Mode Register 0 (CSIM0).
Note about the BSYE flag in Figure 17-5. Serial Bus Interface Control Register Format has been
changed.
Precautions have been added to 17.4.3 (2) (a) Bus release signal (REL), (b) Command signal
(CMD).
19.4.3 (3) (d) Busy control option, (e) Busy & strobe control option, and (f) Bit slippage
detection function have been changed to (4) Synchronization control, and the explanation has
been improved.
20.4.2 (2) (d) Reception
Conditions of INTSR generation when receive error occurrs has been corrected.
Figure 20-10. Receive Error Timing has been corrected, and note has been added.
20.4.3 (3) MSB/LSB switching as the start bit has been added.
20.4.4 Restrictions on using UART mode has been added.
Precautions have been added to Table 27-1. Differences between µPD78P078, 78P078Y and Mask
ROM Versions.
APPENDIX A DIFFERENCES BETWEEN µPD78078, 78075B SUBSERIES AND µPD78070A has
been added.
APPENDIX B DEVELOPMENT TOOL
Entirely revised: Supports in-circuit emulator IE-78K0-NS
APPENDIX C EMBEDDED SOFTWARE
Entirely revised: Fuzzy inference developing support system has been deleted.
The mark shows major revised points.
6

6 Page



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部品番号部品説明メーカ
UPD78P078

8 Bit Single-Chip Microcontrollers

NEC
NEC


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