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PDF DGT409BCA6565 Data sheet ( Hoja de datos )
| Número de pieza | DGT409BCA6565 | |
| Descripción | Reverse Blocking Gate Turn-off Thyristor | |
| Fabricantes | Dynex | |
| Logotipo |  |
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Replaces January 2000 version, DS4414-4.0
DGT409BCA
DGT409BCA
Reverse Blocking Gate Turn-off Thyristor
DS4414-4.1 February 2002
APPLICATIONS
The DGT409 BCA is a symmetrical GTO designed for
applications which specifically require a reverse blocking
capability, such as current source inverters (CSI). Reverse
recovery ratings and characteristics are included.
FEATURES
s Reverse Blocking Capability
s Double Side Cooling
s High Reliability In Service
s High Voltage Capability
s Fault Protection Without Fuses
s Turn-off Capability Allows Reduction In Equipment Size
And Weight. Low Noise Emission Reduces Acoustic
Cladding Necessary For Environmental Requirements
ORDERING INFORMATION
Order as: DGT409BCA6565
KEY PARAMETERS
ITCM
1500A
VDRM/VDRM
6500V
dVD/dt
1000V/µs
diT/dt
300A/µs
Outline type code: CA
See Package Details for further information
Fig. 1 Package outline
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1 page  
DGT409BCA
IT
QS VR
IRR
15µs
CURVES
Fig.3 Reverse recovery waveforms
2.0 4.0
1.8 IGT
1.6
3.6
3.2
1.4 2.8
1.2 2.4
1.0 2.0
0.8 1.4
VGT
0.6 1.2
0.4 0.8
0.2 0.4
0
–50 –25
0
0 25 50 75 100 125 150
Junction temperature, Tj - (˚C)
Fig.4 Maximum gate trigger voltage/current vs junction
temperature
1000
900
800
700 Tj = 25˚C
600
500
Tj = 115˚C
400
300
200
100
0
01 2 3 4 5 6 7
Instantaneous on-state voltage, VT - (V)
Fig.5 Maximum on-state characteristics
8
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5 Page 
DGT409BCA
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability
of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of pre-loaded
clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of ‘T’ 23mm and ‘E’ 30mm
discs, and bar clamps right up to 83kN for our ‘Z’ 100mm thyristors and diodes.
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer
Services.
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
http://www.dynexsemi.com
e-mail: [email protected]
CUSTOMER SERVICES
Tel: +44 (0)1522 502753/502901. Fax: +44 (0)1522 500020
SALES OFFICES
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
Rest Of World Tel: +44 (0)1522 502753/502901. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 Publication No. DS4414-4 Issue No. 4.1 February 2002
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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