DataSheet.jp

28F008B3 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 28F008B3
部品説明 SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
メーカ Intel
ロゴ Intel ロゴ 



Total 49 pages
		

No Preview Available !

28F008B3 Datasheet, 28F008B3 PDF,ピン配置, 機能
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
BYTE-WIDE
8-MBIT (1024K x 8), 16-MBIT (2056K x 8)
FLASH MEMORY FAMILY
28F008B3, 28F016B3
n Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V VPP Fast Production
Programming
n 2.7V or 1.8V I/O Option
Reduces Overall System Power
n Optimized Block Sizes
Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 64-Kbyte Blocks
for Code
n High Performance
2.7V–3.6V: 120 ns Max Access Time
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
20 mA Maximum Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40°C to +85°C
n Supports Code plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Extended Cycling Capability
10,000 Block Erase Cycles
n Automated Byte Program and Block
Erase
Command User Interface
Status Registers
n SRAM-Compatible Write Interface
n Automatic Power Savings Feature
n Reset/Deep Power-Down
1 µA ICCTypical
Spurious Write Lockout
n Standard Surface Mount Packaging
48-Ball µBGA* Package
40-Lead TSOP Package
n Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
n ETOX™ V (0.4 µ) Flash Technology
n x8-Only Input/Output Architecture
For Space-Constrained 8-bit
Applications
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide
products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001

1 Page





ページ 合計 : 49 ページ
PDF
ダウンロード
[ 28F008B3.PDF ]

共有リンク

Link :

おすすめデータシート

部品番号部品説明メーカ
28F008B3

SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE

Intel
Intel

www.DataSheet.jp    |   2019   |  メール    |   最新    |   Sitemap