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PDF STK392-020 Data sheet ( Hoja de datos )
| Número de pieza | STK392-020 | |
| Descripción | Convergence Correction Circuit Three Channels | |
| Fabricantes | Sanyo | |
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Ordering number : EN4688
Thick Film Hybrid IC
STK392-020
Convergence Correction Circuit
Three Channels in a Single Package
(Maximum Output Current: 6 A)
Overview
The STK392-020 is a hybrid IC for video projector
convergence correction. Since this IC integrates three
output amplifier circuits in a single package, the six
convergence correction output circuits, i.e., the vertical
and horizontal directions for each CRT of the RGB can be
formed from only two ICs.
Applications
Video projectors (both standard and high definition)
Features
• Three output amplifier circuits integrated in a single
22-pin package
• High absolute maximum supply voltage
(VCC max = ±44 V)
• Low thermal resistance (θj-c = 2.1 °C/W)
• High thermal stability (TC max = 125°C)
• Isolated early stage and output stage power supplies
• Output stage power supply switching supports high
efficiency designs.
• The input system, power supply system and output
system pins are isolated in the pin arrangement, thus
reducing the influence of the pattern layout on the
characteristics and easing design.
• Since constant current circuits are used in the pre-driver
stage, operation is stable with respect to the power
supply switching.
• The Sanyo convergence correction circuit product
lineup (the STK392-000 series) handles a wide range of
end-product classes. Therefore, the same PCB can be
used for end products from popularly-priced units to
top-of-the-line models.
Package Dimensions
unit: mm
4086A
[STK392-020]
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Maximum supply voltage
Maximum collector current
Thermal resistance
Junction temperature
Operating substrate temperature
Storage temperature
Symbol
VCC max
IC
θj-c
Tj
Tc
Tstg
Conditions
Tr8, 10, 18, 20, 28, 30
Tr8, 10, 18, 20, 28, 30 (per transistor)
Ratings
±44
+6.0
2.1
150
125
–30 to +125
Unit
V
A
°C/W
°C
°C
°C
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
O3098HA (OT)/61094TH(OT) 5-3382 No. 4688-1/8
1 page  
Thermal Design
STK392-020
1. Tj max, Tc max, and θj-c
Tj max, Tc max, and θj-c are stipulated in the maximum ratings as required parameters for thermal design.
• Tj max (junction temperature)
Tj max is a parameter that is due to the physical structure of the internal devices. Since devices will be degraded or
destroyed if Tj exceeds this value, the design must not allow this value to be exceeded.
• Tc max (operating substrate temperature)
Tc max is a parameter that arises from the internal devices, the materials used, and the circuit design. It is
determined based on comprehensive considerations, including reliability. Devices are not guaranteed if they are
operated with Tc exceeding this value.
• θj-c (thermal resistance)
θj-c differs for each device in the design, and is stipulated in the maximum ratings since it is required to calculate
Tj for the major devices in the design.
Note that Tj and Tc are independent parameters that depend on the operating conditions, and the thermal design must
fulfill the maximum ratings of both these parameters.
2. Approaches to Thermal Design
Let Pd be the IC case internal operating power dissipation, and Pc be the power dissipation per power transistor. The
required heat sink thermal resistance (θc-a) for this case internal power dissipation (Pd) can be derived as follows:
Condition 1: Taking Ta to be the end product guaranteed ambient temperature, the IC case temperature Tc must not
exceed 125°C.
Pd × θc-a + Ta < 125°C (Tc max)................................x
Condition 2: The power transistor junction temperature must not exceed 150°C.
Pd × θc-a + Pc × θj-c + Ta < 150°C (Tj max)..............y
Where θj-c is the thermal resistance per power transistor.
The thermal design must fulfill these above conditions.
3. Design Procedure
The figure at right shows a model of the STK392-020 channel 1 circuit. STK392-020 Circuit Model (channel 1)
Taking the Pd’s of each channel to be Pd1 (channel 1), Pd2 (channel 2)
and Pd3 (channel 3), the total Pd max can be determined as:
Pd max = Pd1 max + Pd2 max + Pd3 max
That is, condition x gives:
θc-a
< Tc
max
Pd
– Ta
max
max
..............................................z
which allows the required heat sink thermal resistance to be derived.
(Here, Tc max is taken to be 125°C.)
Also, taking the power dissipation per power transistor for each channel
to be Pc, the transistor junction temperature Tj will be:
Tj = Pd max × θc-a + Ta + Pc + θj-c............................{
and this can be used to confirm that Tj does not exceed Tj max (150°C).
At this point, if Tj exceeds 150°C in the design, Tc must be lowered by lowering the heat sink thermal resistance
θc-a so that Tj does not exceed 150°C.
No. 4688-5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet STK392-020.PDF ] | |
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