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UPD64 の電気的特性と機能

UPD64のメーカーはNECです、この部品の機能は「4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD64
部品説明 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
メーカ NEC
ロゴ NEC ロゴ 




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UPD64 Datasheet, UPD64 PDF,ピン配置, 機能
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD63, 63A, 64
4-BIT SINGLE-CHIP MICROCONTROLLER
FOR INFRARED REMOTE CONTROL TRANSMISSION
DESCRIPTION
Equipped with low-voltage 1.8 V operation, a carrier generation circuit for infrared remote control transmission,
a standby release function through key entry, and a programmable timer, the µPD63, 63A, and 64 are suitable for
infrared remote control transmitters.
For the µPD63, 63A and 64, we have made available the one-time PROM product µPD6P4B for program
evaluation or small-quantity production.
FEATURES
• Program memory (ROM)
· µPD63 : 512 × 10 bits
· µPD63A: 768 × 10 bits
· µPD64 : 1002 × 10 bits
• Data memory (RAM): 32 × 4 bits
• Built-in carrier generation circuit for infrared remote control
• 9-bit programmable timer
: 1 channel
• Command execution time
: 8 µs (when operating at fX = 8 MHz: ceramic oscillation)
• Stack level
: 1 level (Stack RAM is for data memory RF as well.)
• I/O pins (KI/O)
: 8 units
• Input pins (KI)
: 4 units
• Sense input pin (S0)
: 1 unit
• S1/LED pin (I/O)
: 1 unit (When in output mode, this is the remote control transmission display
pin.)
• Power supply voltage
: VDD = 1.8 to 3.6 V (when operating at fX = 4 MHz)
VDD = 2.2 to 3.6 V (when operating at fX = 8 MHz)
• Operating ambient temperature : TA = –40 to +85 ˚C
• Oscillator frequency
: fX = 2.4 to 8 MHz
• POC circuit (Mask option)
APPLICATION
Infrared remote control transmitter (for AV and household electric appliances)
Unless otherwise stated, the µPD63 is taken as a representative product in this document.
The information in this document is subject to change without notice.
Document No. U11371EJ3V0DS00 (3rd edition)
Date Published November 1998 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1996

1 Page





UPD64 pdf, ピン配列
µPD63, 63A, 64
BLOCK DIAGRAM
REM
CARRIER
GENERATOR
S1/LED
9-bit
TIMER
CPU
CORE
ROM
4 PORT KI 4 KI0-KI3
8 PORT KI/O 8 KI/O0-KI/O7
2 PORT S 2 S0, S1/LED
RAM
SYSTEM
CONTROL
RESET
XIN
XOUT
VDD
GND
LIST OF FUNCTIONS
Item
ROM capacity
RAM capacity
Stack
I/O pins
Number of keys
Clock frequency
Instruction execution time
Carrier frequency
Timer
POC circuit
Supply voltage
Operating ambient temperature
Package
µPD63
µPD63A
µPD64
µPD6P4B
512 × 10 bits
768 × 10 bits
1002 × 10 bits
1002 × 10 bits
Mask ROM
One-time PROM
32 × 4 bits
1 level (multiplexed with RF of RAM)
• Key input (KI)
:4
• Key I/O (KI/O)
:8
• Key extended input (S0, S1)
:2
• Remote control transmission display output (LED) : 1 (multiplexed with S1 pin)
• 32 keys
• 48 keys (when extended by key extension input)
• 96 keys (when extended by key extension input and diode)
Ceramic oscillation
• fX = 2.4 to 8 MHz
• fX = 2.4 to 4 MHz
8 µs (fX = 8 MHz)
fX/8, fX/16, fX/64, fX/96, fX/128, fX/192, no carrier (high level)
9-bit programmable timer: 1 channel
Mask option
Internal
• VDD = 1.8 to 3.6 V
• VDD = 2.2 to 3.6 V (with POC circuit)
VDD = 2.2 to 3.6 V
(fX = 2.4 to 4 MHz)
VDD = 2.7 to 3.6 V
(fX = 4 to 8 MHz)
• TA = –40 to +85 °C
• TA = –20 to +70 °C (with POC circuit)
• 20-pin plastic SOP (300 mil)
• 20-pin plastic
SOP (300 mil)
• 20-pin plastic
SSOP (300 mil)
• 20-pin plastic
SOP (300 mil)
3


3Pages


UPD64 電子部品, 半導体
µPD63, 63A, 64
1. PIN FUNCTIONS
1.1 List of Pin Functions
Pin No.
1
2
15-20
3
4
5
6
7
8
9
10
11-14
Symbol
Function
KI/O0-KI/O7
These pins refer to the 8-bit I/O ports. I/O switching can
be made in 8-bit units.
In INPUT mode, a pull-down resistor is added.
In OUTPUT mode, they can be used as the key scan
output of the key matrix.
S0 Refers to the input port.
Can also be used as the key return input of the key
matrix.
In INPUT mode, the availability of the pull-down resistor
of the S0 and S1 ports can be specified by software in
terms in 2-bit units.
If INPUT mode is canceled by software, this pin is placed
in OFF mode and enters the high-impedance state.
S1/LED
Refers to the I/O port.
In INPUT mode (S1), this pin can also be used as the key
return input of the key matrix.
The availability of the pull-down resistor of the S0 and S1
ports can be specified by software in 2-bit units.
In OUTPUT mode (LED), it becomes the remote control
transmission display output (active low). When the
remote control carrier is output from the REM output, this
pin outputs the low level from the LED output synchronously
with the REM signal.
REM
Refers to the infrared remote control transmission output.
The output is active high.
Carrier frequency: fX/8, fX/64, fX/96, high-level, fX/16,
fX/128, fX/192 (usable on software)
VDD Refers to the power supply.
XOUT
XIN
GND
RESET
These pins are connected to system clock ceramic
resonators.
Refers to the ground.
Normally, this pin is a system reset input. By inputting
a low level, the CPU can be reset. When resetting with
the POC circuit (mask option) a low level is output. A
pull-up resistor is incorporated.
KI0-KI3Note 2
These pins refer to the 4-bit input ports.
They can be used as the key return input of the key
matrix.
The use of the pull-down resistor can be specified by
software in 4-bit units.
Output Format
CMOS
push-pullNote 1
CMOS push-pull
CMOS push-pull
When Reset
High-level output
High-impedance
(OFF mode)
High-level output
(LED)
Low-level output
Low level
(oscillation stopped)
Input (low-level)
Notes 1. Be careful about this because the drive capability of the low-level output side is held low.
2. In order to prevent malfunction, be sure to input a low level to more than one of pins KI0 to KI3 when
reset is released (when RESET pin changes from low level to high level, or POC is released due to
supply voltage startup).
6

6 Page



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