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PDF UPD4704 Data sheet ( Hoja de datos )
| Número de pieza | UPD4704 | |
| Descripción | EXTENSION 8-BIT UP/DOWN COUNTER CMOS INTEGRATED CIRCUITS | |
| Fabricantes | NEC | |
| Logotipo |  |
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DATA SHEET
MOS INTEGRATED CIRCUIT
µPD4704
EXTENSION 8-BIT UP/DOWN COUNTER
CMOS INTEGRATED CIRCUITS
DESCRIPTION
The µPD4704 is 8-bit up/down counters for extension of the µPD4702 incremental encoder counter. They perform
an up/down-count using an 8-bit width with a µPD4702 carry or borrow signal as input. In addition, a carry output
and borrow output are also provided for further extension of the count width, enabling extension to be performed
in 8-bit units.
FEATURES
• 8-bit up/down counter for extension of µPD4702
• Count data output controllable (latch and 3-state output)
• Extension carry and borrow outputs
• CMOS, single +5 V power supply
PIN NAMES
Up : Up-count input
Down : Down-count input
Reset : Counter reset input
STB : Latch strobe signal input
OE : Output control signal input
CD0-7 : Count data outputs
Carry : Carry pulse output
Borrow : Borrow pulse output
ORDERING INFORMATION
Part Number
µPD4704C
µPD4704G
Package
20-pin plastic DIP (300 mil)
20-pin plastic SOP (300 mil)
PIN CONFIGURATION (Top View)
Reset
A
B
NC
CD0
CD1
CD2
CD3
NC
VSS
1
2
3
4
5
6
7
8
9
10
20 VDD
19 Carry
18 Borrow
17 STB
16 OE
15 CD7
14 CD6
13 CD5
12 CD4
11 NC
Document No. IC-3305A (2nd edition)
(O. D. No. IC-8762B)
Date Published April 1997 P
Printed in Japan
© 1993
1 page  
Fig. 2 Relation Between STB Timing and Counter Value
UP/DOWN
STB
tSUDSTB1
tSUDSTB2
Pre-count value latched
Post-count value latched
Either pre- or post-count value latched
UP/DOWN
Fig. 3 STB and RESET Timing
tSUDSTB1
tDUDCD
RESET
STB
µPD4704
If STB changes from "H" to "L" and a reset is
executed in this period, the latch is also reset.
(3) Carry & borrow outputs
If the counter performs an up-count operation when the count value is 0FFH, an active-low pulse is output to the
Carry output (the pulse width is virtually the same as the UP or DOWN pulse L period). Similarly, if the counter
performs a down-count operation when the count value is 00H, an active-low pulse is output to the Borrow output.
A Borrow pulse is also output if a down-count operation is performed while RESET is "H" (during a reset), and
therefore, when a µPD4704 is added, a reset must be executed at the same time.
5
5 Page 
µPD4704
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (IEI-1207).
µPD4704G
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
q
* Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”.
TYPES OF THROUGH HOLE MOUNT DEVICE
µPD4704C
Soldering process
Wave soldering
Soldering conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below
REFERENCE
Dcodument name
NEC semiconductor device reliability/quality control system
Quality grade on NEC semiconductor devices
Semiconductor device mounting technology manual
Semiconductor device package manual
Guide to quality assurance for semiconductor devices
Semiconductor selection guide
Symbol
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet UPD4704.PDF ] | |
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