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PDF UPD16310GF-3L9 Data sheet ( Hoja de datos )

Número de pieza UPD16310GF-3L9
Descripción HIGH VOLTAGE CMOS DRIVER FOR PDP/ EL/ VFD
Fabricantes NEC 
Logotipo NEC Logotipo



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No Preview Available ! UPD16310GF-3L9 Hoja de datos, Descripción, Manual

MOS INTEGRATED CIRCUIT
µPD16310
HIGH VOLTAGE CMOS DRIVER FOR PDP, EL, VFD
DESCRIPTION
µPD16310 is high voltage driver for PDP, EL or VFD graphic panel structured by CMOS process. Logic power
supply is 5.0 V connecting direct to control logic. Maximum output voltage is 80 V and maximum current is 50 mA.
FEATURES
• 80 V Output Voltage Swing Capability
• 50 mA Output Sink and Source Current Capability
• 40 bit Shift-register and Latch
• High Speed Serial DATA Transferring (fmax. = 20 MHz MIN.)
• Low Standby Current 100 µA
ORDERING INFORMATION
Part Number
µPD16310GF-3L9
Package
80-pin plastic QFP (3 direction lead)
Document No. IC-2859 (1st edition)
Date Published March 1997 P
Printed in Japan
© 1993

1 page




UPD16310GF-3L9 pdf
TIMING CHART
A (B)
(INPUT)
CLK
S1
(S40)
S2
(S39)
S3
(S38)
STB
BLK
PC
O1
(O40)
O2
(O39)
O3
(O38)
µPD16310
( ) : R/L = L
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UPD16310GF-3L9 arduino
µPD16310
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
offices in case other soldering process is used, or in case soldering is done under different conditions.
µPD16310GF-3L9
Soldering process
Infrared ray reflow
VPS
Partial heating method
Soldering conditions
Peak package’s surface temperature: 230 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Terminal temperature: 300 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR30-00-1
VP15-00-1
* Exposure limit before soldering after dry-pack package is opened.
Storage coditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method.”
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