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PDF UPC667 Data sheet ( Hoja de datos )
| Número de pieza | UPC667 | |
| Descripción | 10-BIT D/A CONVERTER | |
| Fabricantes | NEC | |
| Logotipo |  |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC667
10-BIT D/A CONVERTER
The µPC667 is high-speed and high-precision 10-bit D/A converter.
Clock rate of the µPC667 is 60 Msps. Conversion precision of the µPC667 is ±1.0 LSB.
FEATURES
• Resolution
10-bit
• Clock rate
60 Msps
• Technology
Bi-CMOS
• Power supply
+5 V
• D/A conversion method
R-2R ladder resistance and segment summing system
• Analog output form
Voltage output type
• Built-in reference voltage generating circuit
ORDERING INFORMATION
Part Number
µPC667CT
Package
30-pin plastic shrink DIP (400 mil)
The information in this document is subject to change without notice.
Document No. S11099EJ2V0DS00 (2nd edition)
(Previous No. IC-3250)
Date Published February 1996 P
Printed in Japan
The mark 5 shows major revised points.
©
1993, 1996
1 page  
µPC667
Pin Name
Pin No.
VREF
25
Input/
Output
Input
Function
Reference voltage
The output full-scale range is set
according to the voltage applied to
this pin. Apply standard 4.0 V.
When no adjustment is necessary,
connect the output from VROUT pin
directly to this pin.
AOUT
26
Output Analog signal
Analog signal output pin.
Equivalent Circuit
AVCC
5 kΩ
AGND
20 µA
AGND
AVCC
AVCC
112.5 Ω
225 Ω
112.5 Ω
AGND
112.5 Ω
R-2R
Ladder
resistance
COMP
27
— Phase compensation
Phase compensating capacitor
connection pin for full-scale ampli-
fier. Approx. 0.1 µF capacitor must
be connected between this pin and
AVCC pin.
AVCC
AGND AGND
AVCC
9.7 kΩ 9.7 kΩ
AGND
AVCC
AVCC
AVCC
AGND
NC
24, 28
23, 29
13, 15 to 19
— Power supply for analog circuit
— Ground for analog circuit
— No Connection
AGND
AGND
AVCC
COMP
AGND
5
5 Page 
µPC667
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(IEI-1207).
Through-hole device
µPC667CT: 30-pin plastic Shrink DIP (400 mil)
Process
Wave soldering
(only to leads)
Partial heating method
Conditions
Solder temperature: 260 ˚C or below,
Flow time: 10 seconds or less.
Terminal temperature: 300 ˚C or below,
Heat time: 3 seconds or less (Per each lead).
Caution For through-hole devices, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
5
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UPC667.PDF ] | |
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