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PDF UPC29S78GR Data sheet ( Hoja de datos )
| Número de pieza | UPC29S78GR | |
| Descripción | LOW DROPOUT VOLTAGE REGULATOR WITH ON/OFF FUNCTION | |
| Fabricantes | NEC | |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC29S00 Series
LOW DROPOUT VOLTAGE REGULATOR WITH ON/OFF FUNCTION
The µPC29S00 series is a low dropout regulator which has 100 mA capable for the output current. This series
features ON/OFF function to control output voltage.
The µPC29S00 series is suitable for NEC’s single chip microcontroller which have on-chip flash memory. The
µPC29S00 series is use of erasing and writing data on its flash memory.
FEATURES
• ON/OFF control function (Active high)
• High accuracy output voltage : ±2% (7.8 V output)
• Output current excess of 100 mA
–2% to +1% (10 V output)
• Surface mount device package
• On-chip all kinds of protection circuit
: 4-pin plastic SIP (TO-126 Gullwing) (7.8 V output)
8-pin plastic SOP (225mil) (7.8 V output, 10 V output)
ORDERING INFORMATION
Part Number
µPC29S78H
µPC29S78TA
µPC29S78GR
µPC29S10GR
Package
4-pin plastic SIP (TO-126)
4-pin plastic SIP (TO-126 Gullwing)
8-pin plastic SOP (225 mil)
8-pin plastic SOP (225 mil)
Output Voltage
7.8 V
7.8 V
7.8 V
10 V
PIN CONFIGURATIONS (Marking Side)
TO-126
• µPC29S78H
TO-126 Gullwing
• µPC29S78TA
8-pin plastic SOP (225mil)
• µPC29S78GR
• µPC29S10GR
1234
1: INPUT
2: ON/OFF
3: GND
4: OUTPUT
INPUT 1
NC 2
ON/OFF 3
NC 4
8 OUTPUT
7 NC
6 GND
5 NC
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. G12905EJ4V0DS00 (4th edition)
Date Published August 1999 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1997
1 page  
µPC29S00 Series
µPC29S10 (VIN = 12 V, IO = 50 mA, VON/OFF = 5 V, TJ = 25°C, unless otherwise specified.)
Parameter
Output Voltage
Symbol
VO
Line Regulation
Load Regulation
Quiescent Current
REGIN
REGL
IBIAS
Start-up Quiescent Current
Quiescent Current Change
IBIAS(s)1
IBIAS(s)2
∆IBIAS
Output Noise Voltage
Ripple Rejection
Dropout Voltage
Peak Output Current
Short Circuit Current
Temperature Coefficient of Output
Voltage
ON/OFF Voltage
ON/OFF Current
Standby Current
Vn
R·R
VDIF
IO peak
IO short
∆VO/∆T
VON/OFF1
VON/OFF2
ION/OFF1
ION/OFF2
IBIAS OFF
Conditions
11 V ≤ VIN ≤ 18 V,
0 mA ≤ IO ≤ 50 mA,
0°C ≤ TJ ≤ +125°C
0 mA ≤ IO ≤ 100 mA,
0°C ≤ TJ ≤ +125°C
11 V ≤ VIN ≤ 18 V
0 mA ≤ IO ≤ 100 mA
IO = 0 mA
IO = 100 mA
VIN = 9.5 V, IO = 0 mA
VIN = 9.5 V, IO = 100 mA
11 V ≤ VIN ≤ 18 V,
0°C ≤ TJ ≤ +125°C
10 Hz ≤ f ≤ 100 kHz
f = 120 Hz, 11 V ≤ VIN ≤ 13.5 V
IO = 100 mA, 0°C ≤ TJ ≤ +125°C
VIN = 12 V
VIN = 18 V
IO = 5 mA, 0°C ≤ TJ ≤ +125°C
VIN = 12 V, IO = 10 mA
VIN = 12 V, IO = 0 mA
VON/OFF = 2.7 V, IO = 0 mA
VON/OFF = 5 V, IO = 0 mA
VON/OFF = 0 V, IO = 0 mA
MIN.
9.80
9.70
TYP.
10.00
MAX.
10.10
10.20
Unit
V
9.70
10.20
27 100 mV
18 100 mV
3.3 5.0 mA
12 25
10 20 mA
50 mA
1.0 10 mA
210
µVr.m.s.
40 48
dB
0.4 1.0
V
150 250 400 mA
180 mA
–0.5
mV/°C
1.8 2.0
V
0.8 1.6
V
250 450 µA
450 800 µA
10 µA
Data Sheet G12905EJ4V0DS00
5
5 Page 
µPC29S00 Series
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface mount devices
µPC29S78TA: 4-pin plastic SIP (TO-126 Gullwing)
Process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Conditions
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
µPC29S78GR, 29S10GR: 8-pin plastic SOP (225 mil)
Process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Conditions
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times.
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Data Sheet G12905EJ4V0DS00
11
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