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PDF UPB1510GV Data sheet ( Hoja de datos )
| Número de pieza | UPB1510GV | |
| Descripción | 3 GHz INPUT DIVIDE BY 4 PRESCALER IC FOR DBS TUNERS | |
| Fabricantes | NEC | |
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DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µPB1510GV
3 GHz INPUT DIVIDE BY 4 PRESCALER IC
FOR DBS TUNERS
The µPB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. The µPB1510GV is
suitable for use of frequency divider for PLL synthesizer block. The µPB1510GV is a shrink package version of the
µPB585G so that this small package contributes to reduce the mounting space.
The µPB1510GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses
silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High toggle frequency
: fin = 0.5 GHz to 3.0 GHz
• High-density surface mounting : 8-pin plastic SSOP (175 mil)
• Low current consumption
: 5 V, 14 mA TYP.
• Fixed division
: ÷4
APPLICATION
• Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
• DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
Part Number
µPB1510GV-E1
Package
8-pin plastic SSOP
(175 mil)
Marking
1510
Supplying Form
Embossed tape 8 mm wide.
Pin 1 is in tape pull-out direction.
1000 p/reel
Remark To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order: µPB1510GV)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice.
Document No. P12752EJ2V0DS00 (2nd edition)
Date Published October 1998 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1997
1 page  
µ PB1510GV
TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 5 V, unless otherwise specified)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
20
No input signal
15
10 TA = 85 °C
TA = 25 °C
TA = –40 °C
5
0
01234567
VCC - Supply Voltage - V
INPUT POWER vs. INPUT FREQUENCY
20
TA = 25 °C
10
0
Guaranteed
operating range
–10
–20
VCC = 4.5 to 5.5 V
–30
–40
–50
0.1
0.5 1
3
fin - Input Frequency - GHz
10
OUTPUT POWER vs. INPUT FREQUENCY
0
–5
TA = 25 °C
TA = 85 °C
TA = –40 °C
–10
VCC = 5 V
Pin = 0 dBm
ZL = 50 Ω
–15
0.1
0.5
1
3
fin - Input Frequency - GHz
10
INPUT POWER vs. INPUT FREQUENCY
20
TA = –40 °C
TA = 25 °C
10
TA = 85 °C
0
TA = 85 °C
–10 TA = 25 °C
Guaranteed
operating range
–20
TA = –40 °C
–30
–40
VCC = 5 V
–50
0.1
0.5
1
3
fin - Input Frequency - GHz
10
OUTPUT POWER vs. INPUT FREQUENCY
0
VCC = 5 V
–5
VCC = 5.5 V
VCC = 4.5V
–10
TA = 25 °C
Pin = 0 dBm
ZL = 50 Ω
–15
0.1
0.5
1
3
fin - Input Frequency - GHz
10
5
5 Page 
µ PB1510GV
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limitNote: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limitNote: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limitNote: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UPB1510GV.PDF ] | |
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