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TEA1093TのメーカーはNXP Semiconductorsです、この部品の機能は「Hands-free IC」です。 |
部品番号 | TEA1093T |
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部品説明 | Hands-free IC | ||
メーカ | NXP Semiconductors | ||
ロゴ | |||
このページの下部にプレビューとTEA1093Tダウンロード(pdfファイル)リンクがあります。 Total 28 pages
INTEGRATED CIRCUITS
DATA SHEET
TEA1093
Hands-free IC
Product specification
Supersedes data of 1995 May 18
File under Integrated Circuits, IC03
1996 Feb 09
1 Page Philips Semiconductors
Hands-free IC
Product specification
TEA1093
QUICK REFERENCE DATA
VSREF = 4.2 V; VGND = 0 V; ISUP = 15 mA; VSUP = 0 V (RMS); f = 1 kHz; Tamb = 25 °C; PD = LOW; MUTET = LOW;
RL = 50 Ω; RVOL = 0 Ω; measured in test circuit of Fig.15; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
ISUP
VBB
IBB(pd)
operating supply current (pin SUP)
stabilized supply voltage
current consumption from pin VBB in
power-down condition
PD = HIGH; VBB = 3.6 V
7
3.35
−
−
3.6
400
140 mA
3.85 V
550 µA
ISUP(pd)
current consumption from pin SUP in
power-down condition
PD = HIGH; Vsup = 4.5 V −
55 75 µA
Gvtx
∆Gvtxr
Gvrx
voltage gain from pin MIC to pin MOUT in
transmit mode
voltage gain adjustment with RGAT
voltage gain in receive mode
the difference between RIN1 and RIN2
to LSP1 or LSP2 single-ended load
VMIC = 1 mV (RMS);
RGAT = 30.1 kΩ
VRIN = 20 mV (RMS);
RGAR = 66.5 kΩ;
RL = 50 Ω
12.5 15
−10 −
15.5 18
17.5 dB
+10 dB
20.5 dB
the difference between RIN1 and RIN2
to the difference between LSP1 and
LSP2 bridge-tied load
21.5 24
26.5 dB
∆Gvrxr
VO(p-p)
voltage gain adjustment with RGAR
bridge-tied load (peak-to-peak value)
SWRA
∆SWRA
Tamb
switching range
switching range adjustment with RSWR
referenced to RSWR = 365 kΩ
operating ambient temperature
VRIN = 150 mV (RMS);
RL = 33 Ω; note 1
−15
−
−
−40
−25
− +15
5.15 −
40 −
− +12
− +75
dB
V
dB
dB
°C
Note
1. Corresponds to 100 mW output power.
1996 Feb 09
3
3Pages Philips Semiconductors
Hands-free IC
Product specification
TEA1093
FUNCTIONAL DESCRIPTION
The values given in the functional description are typical
values except when otherwise specified.
A principle diagram of the TEA106X is shown on the left
side of Fig.3. The TEA106X is a transmission circuit of the
TEA1060 family intended for hand-set operation. It
incorporates a receiving amplifier for the earpiece, a
transmit amplifier for the microphone and a hybrid. For
more details on the TEA1060 family, please refer to “Data
Handbook IC03”. The right side of Fig.3 shows a principle
diagram of the TEA1093, a hands-free add-on circuit with
a microphone amplifier, a loudspeaker amplifier and a
duplex controller.
As can be seen from Fig.3, a loop is formed via the
sidetone network in the transmission circuit and the
acoustic coupling between loudspeaker and microphone
of the hands-free circuit. When this loop gain is greater
than 1, howling is introduced. In a full duplex application,
this would be the case. The loop-gain has to be much
lower than 1 and therefore has to be decreased to avoid
howling. This is achieved by the duplex controller.The
duplex controller of the TEA1093 detects which channel
has the ‘largest’ signal and then controls the gain of the
microphone amplifier and the loudspeaker amplifier so that
the sum of the gains remains constant. As a result, the
circuit can be in three stable modes:
1. Transmit mode (Tx mode): the gain of the microphone
amplifier is at its maximum and the gain of the
loudspeaker amplifier is at its minimum.
2. Receive mode (Rx mode): the gain of the loudspeaker
amplifier is at its maximum and the gain of the
microphone amplifier is at its minimum.
3. Idle mode: the gain of the amplifiers is halfway
between their maximum and minimum value.
The difference between the maximum gain and minimum
gain is called the switching range.
handbook, full pagewidth
telephone
line
HYBRID
sidetone
TEA106X
DUPLEX
CONTROL
TEA1093
acoustic
coupling
MGD218
Fig.3 Hands-free telephone set principles.
1996 Feb 09
6
6 Page | |||
ページ | 合計 : 28 ページ | ||
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部品番号 | 部品説明 | メーカ |
TEA1093 | Hands-free IC | NXP Semiconductors |
TEA1093T | Hands-free IC | NXP Semiconductors |