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PDF TSPDMEDA001-85 Data sheet ( Hoja de datos )

Número de pieza TSPDMEDA001-85
Descripción PRODUCT CAPABILITY SHEET
Fabricantes Microsemi Corporation 
Logotipo Microsemi Corporation Logotipo



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2830 S. Fairview St.
Santa Ana, CA 92704
PH: (714) 979-8220
FAX: (714) 966-5256
PRODUCT
CAPABILITY
Performance Advantages
SHEET
50% real estate reduction over competition
On State Dissipation is 1.5 to 2 times less than competition
Switching Characteristics - (ton) - up to 10 times faster
Can handle 3 times the surge as competition for the same physical area
Custom designs in 3-4 weeks (competition does not offer custom arrangements)
Features
Monolithic Flip Chip Construction, all contacts on one side
Available with solderable surface
Common Anode/Cathode available
Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below)
Available in 5-8.5 Volt versions
Power Rating is 50 Joules at 37°C
Also available in TVS (TVSMEDA Series)
Monolithic Flip Chip
Thyristor Surge
Protection Device
Array
for Implantable
Applications
Proposed Maximum Ratings @ 37°C-Body Temperature (unless otherwise specified)
Part Number
TSPDMEDA001-5
TSPDMEDA001-7.5
TSPDMEDA001-8.5
VDRM
Volts
MAX
5
7.5
8.5
VZ VBO IBO IH VT
VT ITSM
IR
ton
VC
CO
@1 A @8 A
@ VWM
1kV/us @ 50@ 0V
Volts Volts mA mA Volts Volts Amps nA nsec
Volts
pF
MIN MAX MAX MIN MAX MAX MAX MAX MAX
MAX
MAX
6 8 20 1 3
6 30 100 500
10
100
8 12 20 1 3
6 30 100 500
15
100
9 12 20 1 3
6 30 100 500
15
100
Monolithic Flip Chip Configurations
(in development)
2 mm
Max
These Monolithic Arrays will feature
multiple devices on one chip with all
contacts on one surface. The
surfaces are available with a
solderable metal contact.
For more information on these
devices contact Microsemi's Santa
Ana division for custom
configurations and designs.
2 mm
Max
Elementary
Cell
Schematic
Common
Cathode
Common
Anode
Input
MSC0988.PDF

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