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UPG139GV の電気的特性と機能

UPG139GVのメーカーはNECです、この部品の機能は「L-BAND DPDT MMIC SWITCH」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPG139GV
部品説明 L-BAND DPDT MMIC SWITCH
メーカ NEC
ロゴ NEC ロゴ 




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UPG139GV Datasheet, UPG139GV PDF,ピン配置, 機能
DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG139GV
L-BAND DPDT MMIC SWITCH
DESCRIPTION
The µPG139GV is L-Band Double Pole, Double Throw (DPDT) switch developed for digital cellular or cordless
telephone and PCS applications. This device feature low insertion loss, high handling power with low voltage
operation. It is housed in a very small 8-pin plastic SSOP package available on tape-and-reel and easy to install and
contributes to miniaturizing the systems.
FEATURES
{ High-Power Switching : Pin(1 dB) = +34 dBm typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 100 M to 2 GHz
Pin(0.5 dB) = +36 dBm typ. @ANT1, 2-TX, VDD = 5.0 V, VCONT = 5.0 V, f = 100 M to 2 GHz
{ Low Insertion Loss : Lins1 = 0.70 dB typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz
Lins4 = 0.85 dB typ. @ANT1, 2-RX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz
{ Small 8-pin SSOP (175 mil) Package
APPLICATION
{ Digital Cellular: PDC, GSM, IS-95, IS-136 etc.
{ PCS, PHS Base station etc.
ORDERING INFORMATION
Part Number
µPG139GV-E1
Package
8-pin SSOP (175 mil)
Packing Form
Carrier tape width is 12 mm, Quantity is 2 kpcs per reel.
Remark For sample order, please contact your local NEC sales office. (Part number for sample order: µPG139GV)
Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs
MESFET.
The information in this document is subject to change without notice.
Document No. P13144EJ2V0DS00 (2nd edition)
Date Published July 1998 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1998

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UPG139GV pdf, ピン配列
µPG139GV
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameters
Control Voltage (High)
Control Voltage (Low)
Supply Voltage
Input Power (ANT1, 2-TX, VCONT = +5 V)
Input Power (ANT1, 2-RX, VCONT = +5 V)
Input Power (ANT1, 2-TX, VCONT = +3 V)
Input Power (ANT1, 2-RX, VCONT = +3 V)
Symbol
VCONT(H)
VCONT(L)
VDD
Pin
Pin
Pin
Pin
MIN.
+2.7
–0.2
VCONT(H) – 0.7
TYP.
+3.6
0
VCONT(H) – 0.6
MAX.
+5.3
+0.2
VCONT(H) – 0.5
+36
+33
+33
+31
Unit
V
V
V
dBm
dBm
dBm
dBm
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = 25°C, VCONT = +3.6 V/0 V, VDD = +3.0 V, ZS = ZL = 50 )
Parameters
Insertion Loss 1
Insertion Loss 2
Insertion Loss 3
Insertion Loss 4
Insertion Loss 5
Insertion Loss 6
Isolation 1
Isolation 2
Isolation 3
Isolation 4
Input Return Loss
Output Return Loss
1 dB Compression PointNote
1 dB Compression PointNote
Input Power at 0.5 dB
Compression PointNote
Input Power at 0.5 dB
Compression PointNote
Control Current
Switching Speed
Symbol
LINS1
LINS2
LINS3
LINS4
LINS5
LINS6
ISL1
ISL2
ISL3
ISL4
RLin
RLout
Pin(1 dB)1
Pin(1 dB)2
Pin(0.5 dB)3
Pin(0.5 dB)4
ICONT
tsw
Test Conditions
ANT1, 2-TX, f = 100 M to 1 GHz
ANT1, 2-TX, f = 1.5 GHz
ANT1, 2-TX, f = 2 GHz
ANT1, 2-RX, f = 100 M to 1 GHz
ANT1, 2-RX, f = 1.5 GHz
ANT1, 2-RX, f = 2 GHz
ANT1, 2-TX, f = 100 M to 1.5 GHz
ANT1, 2-TX, f = 2 GHz
ANT1, 2-RX, f = 100 M to 1.5 GHz
ANT1, 2-RX, f = 2 GHz
f = 100 M to 2 GHz
f = 100 M to 2 GHz
ANT1, 2-TX, f = 100 M to 2 GHz
ANT1, 2-RX, f = 100 M to 2 GHz
ANT1, 2-TX, f = 100 M to 2 GHz
VCONT = +5 V/0 V VDD = +5.0 V
ANT1, 2-RX, f = 100 M to 2 GHz
VCONT = +5 V/0 V VDD = +5.0 V
RF OFF
MIN.
13.5
10.5
13.5
10.5
11
11
+32
+27
TYP.
0.70
0.90
1.20
0.85
1.05
1.30
15.5
12.5
15.5
12.5
15
15
+34
+30
+36
+33
15
60
MAX.
0.85
1.00
1.30
0.95
1.15
1.40
Unit
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
50 µA
nS
Note Pin (1 dB) and Pin (0.5 dB) are measured the input power level when the insertion loss increase more 1 dB
or 0.5 dB than that of linear range. All other characteristics are measured in linear range.
3


3Pages


UPG139GV 電子部品, 半導体
µPG139GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Infrared Ray Reflow
VPS
Wave Soldering
Partial Heating Method
Soldering Conditions
Peak package’s surface temperature: 235°C or below
Reflow time: 30 seconds or less (at 210°C)
Number of reflow process: 3, Exposure limitNote: None
Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or less (at 200°C)
Number of reflow process: 3, Exposure limitNote: None
Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limitNote: None
Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limitNote: None
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25°C and relative humidity at 65% or less.
Caution Do not apply more than a single process at once, except for “partial heating method”.
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6 Page



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共有リンク

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部品番号部品説明メーカ
UPG139GV

L-BAND DPDT MMIC SWITCH

NEC
NEC
UPG139GV-E1

L-BAND DPDT MMIC SWITCH

NEC
NEC


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