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IRF7404 の電気的特性と機能

IRF7404のメーカーはAnalog Devicesです、この部品の機能は「Thermoelectric Cooler Controller」です。


製品の詳細 ( Datasheet PDF )

部品番号 IRF7404
部品説明 Thermoelectric Cooler Controller
メーカ Analog Devices
ロゴ Analog Devices ロゴ 




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IRF7404 Datasheet, IRF7404 PDF,ピン配置, 機能
FEATURES
High Efficiency
Small Size: 5 mm ؋ 5 mm LFCSP
Low Noise: <0.5% TEC Current Ripple
Long-Term Temperature Stability: ؎0.01؇C
Temperature Lock Indication
Temperature Monitoring Output
Oscillator Synchronization with an External Signal
Clock Phase Adjustment for Multiple Controllers
Programmable Switching Frequency up to 1 MHz
Thermistor Failure Alarm
Maximum TEC Voltage Programmability
APPLICATIONS
Thermoelectric Cooler (TEC) Temperature Control
Resistive Heating Element Control
Temperature Stabilization Substrate (TSS) Control
Thermoelectric Cooler Controller
ADN8830
GENERAL DESCRIPTION
The ADN8830 is a monolithic controller that drives a thermo-
electric cooler (TEC) to stabilize the temperature of a laser diode
or a passive component used in telecommunications equipment.
This device relies on a negative temperature coefficient (NTC)
thermistor to sense the temperature of the object attached to the
TEC. The target temperature is set with an analog input voltage
either from a DAC or an external resistor divider.
The loop is stabilized by a PID compensation amplifier with
high stability and low noise. The compensation network can be
adjusted by the user to optimize temperature settling time. The
component values for this network can be calculated based on
the thermal transfer function of the laser diode or obtained
from the lookup table given in the Application Notes section.
Voltage outputs are provided to monitor both the temperature of
the object and the voltage across the TEC. A voltage reference
of 2.5 V is also provided.
FROM
THERMISTOR
TEMPERATURE
SET
INPUT
VREF
FUNCTIONAL BLOCK DIAGRAM
PID COMPENSATION
NETWORK
TEMPERATURE
MEASUREMENT
AMPLIFIER
PWM
CONTROLLER
VOLTAGE
REFERENCE
OSCILLATOR
MOSFET
DRIVERS
P-CHANNEL
(UPPER MOSFET)
N-CHANNEL
P-CHANNEL
(LOWER MOSFET)
N-CHANNEL
FREQUENCY/PHASE
CONTROL
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved.

1 Page





IRF7404 pdf, ピン配列
ADN8830
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . GND to VS + 0.3 V
Storage Temperature Range . . . . . . . . . . . . . 65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . 40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . 125°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300°C
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Package Type
32-Lead LFCSP (ACP)
JA*
35
JC
10
Unit
°C/W
*JA is specified for worst-case conditions, i.e., JA is specified for a device
soldered in a 4-layer circuit board for surface-mount packages.
Model
ADN8830ACP
ADN8830ACP-REEL
ADN8830ACP-REEL7
ADN8830-EVAL
Temperature Range
40°C to +85°C
40°C to +85°C
40°C to +85°C
ORDERING GUIDE
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Package Option
CP-32-1
CP-32-1
CP-32-1
PIN CONFIGURATION
THERMFAULT 1
THERMIN 2
SD 3
TEMPSET 4
TEMPLOCK 5
NC 6
VREF 7
AVDD 8
PIN 1
INDICATOR
ADN8830
TOP VIEW
24 COMPOSC
23 PGND
22 N1
21 P1
20 PVDD
19 OUT A
18 COMPSWIN
17 COMPSWOUT
NC = NO CONNECT
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN8830 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. C
–3–


3Pages


IRF7404 電子部品, 半導体
ADN8830
1,000
990
VDD = 5V
RFREQ = 150k
980
970
960
950
940
930
920
–40
–15 10 35 60
TEMPERATURE (؇C)
85
TPC 7. Switching Frequency vs. Temperature
70
65
60
55
50
45
40
35
30
–40
–15 10 35 60
TEMPERATURE (؇C)
TPC 8. Offset Voltage vs. Temperature
85
200
100
0
–100
–200
–300
–400
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
COMMON-MODE VOLTAGE (V)
TPC 9. Offset Voltage vs. Common-Mode Voltage
45
VDD = 5V
40 TA = 25؇C
USING CIRCUIT SHOWN IN FIGURE 1
35
30
25
20
15
10
5
0
200 300
400 500 600 700 800
SWITCHING FREQUENCY (kHz)
900 1,000
TPC 10. Supply Current vs. Switching Frequency
2.06
2.05
2.04
2.03
2.02
–40
–15 10 35 60
TEMPERATURE (؇C)
85
TPC 11. Open Thermistor Fault Threshold vs. Temperature
0.26
0.25
0.24
0.23
–40
–15 10 35 60
TEMPERATURE (؇C)
85
TPC 12. Short Thermistor Fault Threshold vs.
Temperature
–6– REV. C

6 Page



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