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K9F1G08Q0M-PIB0 の電気的特性と機能

K9F1G08Q0M-PIB0のメーカーはSamsung semiconductorです、この部品の機能は「1Gb Gb 1.8V NAND Flash Errata」です。


製品の詳細 ( Datasheet PDF )

部品番号 K9F1G08Q0M-PIB0
部品説明 1Gb Gb 1.8V NAND Flash Errata
メーカ Samsung semiconductor
ロゴ Samsung semiconductor ロゴ 




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K9F1G08Q0M-PIB0 Datasheet, K9F1G08Q0M-PIB0 PDF,ピン配置, 機能
ELECTRONICS
March. 2003
San 16 Banwol-Ri
Taean-Eup Hwasung- City
Kyungki Do, Korea
Tel.) 82 - 31 - 208 - 6463
Fax.) 82 - 31 -208 - 6799
1Gb 1.8V NAND Flash Errata
Description : Some of AC characteristics are not meeting the specification.
> AC characteristics : Refer to Table
Affected Products : K9F1G08Q0M-YCB0/YIB0, K9F1G16Q0M-YCB0/YIB0
K9K2G08Q0M-YCB0/YIB0, K9K2G16Q0M-YCB0/YIB0
Improvement schedule : The components targeted to meet the specification
is scheduled to be available by workweek 25 along
with the final specification values.
Workaround : Relax the relevant timing parameters according to the table.
Table
Parameters
tWC
Specification
45
Relaxed Condition 80
tWH
15
20
tWP
25
60
UNIT : ns
tRC tREH tRP tREA tCEA
50 15 25 30 45
80 20 60 60 75
Sincerely,
Product Planning & Application Eng.
Memory Division
Samsung Electronics Co.
1

1 Page





K9F1G08Q0M-PIB0 pdf, ピン配列
K9F1G08U0M-VCB0,VIB0,FCB0,FIB0
K9F1G08Q0M-YCB0,YIB0,PCB0,PIB0 K9F1G16Q0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-YCB0,YIB0,PCB0,PIB0 K9F1G16U0M-YCB0,YIB0,PCB0,PIB0
Document Title
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
FLASH MEMORY
Revision History
Revision No History
0.7 Errata is added.(Front Page)-K9F1GXXQ0M
tWC tWP tWH tRC tREH tRP tREA tCEA
Specification 45 25 15 50 15 25 30 45
Relaxed value 80 60 20 60 80 60 60 75
0.8 1. The 3rd Byte ID after 90h ID read command is don’t cared.
The 5th Byte ID after 90h ID read command is deleted.
Draft Date Remark
Mar.17. 2003
Apr. 9. 2003
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
SAMSUNG
2


3Pages


K9F1G08Q0M-PIB0 電子部品, 半導体
K9F1G08U0M-VCB0,VIB0,FCB0,FIB0
K9F1G08Q0M-YCB0,YIB0,PCB0,PIB0 K9F1G16Q0M-YCB0,YIB0,PCB0,PIB0
K9F1G08U0M-YCB0,YIB0,PCB0,PIB0 K9F1G16U0M-YCB0,YIB0,PCB0,PIB0
FLASH MEMORY
PIN CONFIGURATION (WSOP1)
K9F1G08U0M-VCB0,FCB0/VIB0,FIB0
N.C
N.C
DNU
N.C
N.C
N.C
R/B
RE
CE
DNU
N.C
Vcc
Vss
N.C
DNU
CLE
ALE
WE
WP
N.C
N.C
DNU
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48 N.C
47 N.C
46 DNU
45 N.C
44 I/O7
43 I/O6
42 I/O5
41 I/O4
40 N.C
39 DNU
38 N.C
37 Vcc
36 Vss
35 N.C
34 DNU
33 N.C
32 I/O3
31 I/O2
30 I/O1
29 I/O0
28 N.C
27 DNU
26 N.C
25 N.C
PACKAGE DIMENSIONS
48-PIN LEAD/LEAD FREE PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F
Unit :mm
15.40±0.10
0.70 MAX
0.58±0.04
#1 #48
#24 #25
(0.1Min)
17.00±0.20
5
0.45~0.75
SAMSUNG

6 Page



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部品番号部品説明メーカ
K9F1G08Q0M-PIB0

1Gb Gb 1.8V NAND Flash Errata

Samsung semiconductor
Samsung semiconductor


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