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ISO113B の電気的特性と機能

ISO113BのメーカーはBurr-Brown Corporationです、この部品の機能は「Low-Cost/ High-Voltage/ Internally Powered OUTPUT ISOLATION AMPLIFIER」です。


製品の詳細 ( Datasheet PDF )

部品番号 ISO113B
部品説明 Low-Cost/ High-Voltage/ Internally Powered OUTPUT ISOLATION AMPLIFIER
メーカ Burr-Brown Corporation
ロゴ Burr-Brown Corporation ロゴ 




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ISO113B Datasheet, ISO113B PDF,ピン配置, 機能
®
ISO113
ISO113
Low-Cost, High-Voltage, Internally Powered
OUTPUT ISOLATION AMPLIFIER
FEATURES
q SELF-CONTAINED ISOLATED SIGNAL
AND OUTPUT POWER
q SMALL PACKAGE SIZE: Double-Wide
(0.6") Sidebraze DIP
q CONTINUOUS AC BARRIER RATING:
1500Vrms
q WIDE BANDWIDTH: 20kHz Small Signal,
20kHz Full Power
q BUILT-IN ISOLATED OUTPUT POWER:
±10V to ±18V Input, ±50mA Output
q MULTICHANNEL SYNCHRONIZATION
CAPABILITY
q BOARD AREA ONLY 0.72in.2 (4.6cm2)
APPLICATIONS
q 4mA TO 20mA V/I CONVERTERS
q MOTOR AND VALVE CONTROLLERS
q ISOLATED RECORDER OUTPUTS
q MEDICAL INSTRUMENTATION OUTPUTS
q GAS ANALYZERS
DESCRIPTION
The ISO113 output isolation amplifier provides both
signal and output power across an isolation barrier in
a small double-wide DIP package. The ceramic non-
hermetic hybrid package with side-brazed pins con-
tains a transformer-coupled DC/ DC converter and a
capacitor-coupled signal channel.
Extra power is available on the isolated output side for
driving external loads. The converter is protected from
shorts to ground with an internal current limit, and the
soft-start feature limits the initial currents from the
power source. Multiple-channel synchronization can
be accomplished by applying a TTL clock signal to
paralleled Sync pins. The Enable control is used to
turn off transformer drive while keeping the signal
channel modulator active. This feature provides a
convenient way to reduce quiescent current for low
power applications.
The wide barrier pin spacing and internal insulation
allow for the generous 1500Vrms continuous rating.
Reliability is assured by 100% barrier breakdown
testing that conforms to UL1244 test methods. Low
barrier capacitance minimizes AC leakage currents.
These specifications and built-in features make the
ISO113 easy to use, and provides for compact PC
board layout.
+VCC1
VIN
–VCC1
Com 1
Sync*
Enable
Gnd 1
Duty Cycle Modulator
Sync
Oscillators, Driver
*Ground if not used
Duty Cycle Demodulator
Rectifiers, Filters
+VC
Sense
VOUT
Gnd 2
–VC
+VCC2
Ps Gnd
–VCC2
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1989 Burr-Brown Corporation
PDS-844E
Printed in U.S.A. August, 1999

1 Page





ISO113B pdf, ピン配列
PIN CONFIGURATION
Enable 1
+VCC1
Sync
2
3
–VCC1 4
24 NC
23 Gnd 1
22 VIN
21 Com 1
ABSOLUTE MAXIMUM RATINGS
Supply Without Damage .................................................................... ±18V
VIN, Sense Voltage ............................................................................. ±50V
Com1 to Gnd1 ................................................................................................................ ±200mV
Enable, Sync ......................................................................... Gnd to +VCC1
Continuous Isolation Voltage ..................................................... 1500Vrms
VISO, dv/dt ..................................................................................... 20kV/µs
Junction Temperature .................................................................... +150°C
Storage Temperature ...................................................... –25°C to +125°C
Lead Temperature,10s .................................................................. +300°C
Output Short to Gnd Duration .................................................. Continuous
±VCC2 to Gnd 2 Duration .......................................................... Continuous
Gnd 2 9
VOUT 10
Sense 11
Ps Gnd 12
16 –VC
15 –VCC2
14 +VCC2
13 +VC
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
ISO113
PACKAGE
24-Pin DIP
PACKAGE
DRAWING
NUMBER(1)
231
SPECIFIED
TEMPERATURE
RANGE
–25°C to +85°C
PACKAGE
MARKING
ORDERING
NUMBER(2)
TRANSPORT
MEDIA
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “ISO113/2K5” will get a single 2500-
piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
3 ISO113


3Pages


ISO113B 電子部品, 半導体
Isolation Barrier
VIN LO* LO*
CO CO
24 23 22 21 16 15 14 13
NC Gnd 1 VIN Com 1
–VC –VCC2 +VCC2 +VC
10µF
Tantalum
ISO 113
(1) (2)
Ps
Enable +VCC1 Sync –VCC1 Gnd 2 VOUT Sense Gnd
1 234
9 10 11 12
+VCC1
L
(3)
I
C2
1µF
C1
1µF
RL
Supply
+ Outputs
* Optional Filtering
For LO
0 LO < 10µH
CO < 1µF
For LO
LO 10µH, <10
CO 10µF
–VCC1
NOTES: (1) Enable = pin open or TTL high. (2) Ground sync if not used.
(3) π filter reduces ripple current; LI = 10µH, <10.
FIGURE 1. Signal and Power Connections.
THEORY OF OPERATION
The block diagram on the front page shows the isolation
amplifier’s synchronized signal and power configuration,
which eliminate beat frequency interference. A proprietary
800kHz oscillator chip, power MOSFET transformer driv-
ers, patented square core wirebonded transformer, and single
chip diode bridge provide power to the output side of the
isolation amplifier as well as external loads. The signal
channel capacitively couples a duty-cycle encoded signal
across the ceramic high-voltage barrier built into the pack-
age. A proprietary transmitter-receiver pair of integrated
circuits, laser trimmed at wafer level, and coupled through a
pair of matched “fringe” capacitors, results in a simple,
reliable design.
SIGNAL AND POWER CONNECTIONS
Figure 1 shows the proper power supply and signal connec-
tions. All power supply pins should be bypassed as shown
with the π filter for +VCC1, an option recommended if more
than ±15mA are drawn from the isolated supply. Separate
rectifier output pins (±VCC2) and amplifier supply input pins
(±VC) allow additional ripple filtering and/or regulation. The
separate input common pin and output sense are low current
inputs tied to the signal source ground, and output load,
respectively, to minimize errors due to IR drop in long
conductors. Otherwise, connect Com 1 to Gnd 1, and Sense
to VOUT at the ISO113 socket. The enable pin may be left
open if the ISO113 is continuously operated. If not, a TTL
low level will disable the internal DC/ DC converter. The
Sync input must be grounded for unsynchronized operation
while a 1.2MHz to 2MHz TTL clock signal provides syn-
chronization of multiple units.
The ISO113 isolation amplifier contains a transformer-
coupled DC/DC converter that is powered from the input
side of the isolation amplifier. All power supply pins (2, 4,
13, 14, 15, and 16) of the ISO113 have an internal 0.1µF
capacitor to ground. L1 is used to slow down fast changes in
the input current to the DC/DC converter. C1 is used to help
regulate the voltage ripple caused by the current demands of
the converter. L1, C1, and C2 are optional, however, recom-
mended for low noise applications.
The DC/DC converter creates an unregulated ±15V output
to ±VCC2. If the ISO113 is the only device using the DC/DC
converter for power, pins 13 and 14 and pins 15 and 16 can
be connected directly without CO or LO in the circuit. If an
external capacitor is used in this configuration, it should not
exceed 1µF. This configuration is possible because the
isolation amplifier and the DC/DC converter are synchro-
nized internally.
If additional devices are powered by the DC/DC converter
of the ISO113, the application may require that the ripple
voltage of the ISO113 converter be attenuated, in which
case, LO and CO should be added to the circuit. The inductor
is used to attenuate the ripple current and a higher value
capacitor can be used to reduce the ripple voltage even
further.
OPTIONAL GAIN AND OFFSET ADJUSTMENTS
Rated gain accuracy and offset performance can be achieved
with no external adjustments, but the circuit of Figure 2a may
be used to provide a gain trim of ±0.5% for the values shown.
Greater range may be provided by increasing the size of R1 and
R2. Every 2kincrease in R1 will give an additional 1%
®
ISO113
6

6 Page



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共有リンク

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部品番号部品説明メーカ
ISO113

Low-Cost/ High-Voltage/ Internally Powered OUTPUT ISOLATION AMPLIFIER

Burr-Brown Corporation
Burr-Brown Corporation
ISO113

Low-Cost High Voltage Internally Powered Output Isolation Amp

Texas Instruments
Texas Instruments
ISO113B

Low-Cost/ High-Voltage/ Internally Powered OUTPUT ISOLATION AMPLIFIER

Burr-Brown Corporation
Burr-Brown Corporation


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