DataSheet.jp

61113-003 PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 61113-003
部品説明 GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE
メーカ Micropac Industries
ロゴ Micropac Industries ロゴ 



Total 2 pages
		

No Preview Available !

61113-003 Datasheet, 61113-003 PDF,ピン配置, 機能
61113 GENERAL PURPOSE (NPN) TRANSISTOR
SURFACE MOUNT PACKAGE
(2N2369AUB)
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
Hermetically sealed
Hermetically sealed 3 pin LCC
MIL-PRF-19500 screening available
Applications:
Analog Switches
Signal Conditioning
Small Signal Amplifiers
High Density Packaging
DESCRIPTION
The 61113 is a N-P-N, general-purpose switching and amplifier transistor in a 3 pin leadless chip carrier package. All
packages are hermetically sealed for high reliability and harsh environments. This device is available custom binned to
customer specifications in commercial or screened to MIL-PRF-19500 up to JANS level.
ABSOLUTE MAXIMUM RATINGS
Collector-Base Voltage - VCBO ................................................................................................................................................. 40Vdc
Collector-Emitter Voltage - VCEO.............................................................................................................................................. 15Vdc
Collector-Emitter Voltage - VCES .............................................................................................................................................. 40Vdc
Emitter-Base Voltage - VEBO ................................................................................................................................................... 4.5Vdc
Collector Current – IC(Peak)....................................................................................................................................................... 500mA
Continuous Collector Current ................................................................................................................................................ 200mA
Maximum Junction Temperature........................................................................................................................................... +200°C
Operating Temperature (See part selection guide for actual operating temperature)............................................ -65°C to +125°C
Storage Temperature............................................................................................................................................... -65°C to +200°C
Lead Soldering Temperature (vapor phase reflow for 30 seconds) .......................................................................................215°C
Package Dimensions
Schematic Diagram
ORIENTATION KEY
0.105 [2.67]
0.085 [2.16]
0.125 [3.18]
0.115 [2.92]
0.054[1.37]
0.046 [1.17]
3
3 PLACES
0.036 [0.91]
0.024 [0.61]
21
0.024 [0.61]
0.016 [0.41]
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
C3
E2
B1
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION 725 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 487-6918
www.micropac.com E-MAIL: optosales@micropac.com
8 - 14

1 Page





ページ 合計 : 2 ページ
PDF
ダウンロード
[ 61113-003.PDF ]

共有リンク

Link :

おすすめデータシート

部品番号部品説明メーカ
61113-001

GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE

Micropac Industries
Micropac Industries
61113-002

GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE

Micropac Industries
Micropac Industries
61113-003

GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE

Micropac Industries
Micropac Industries
61113-004

GENERAL PURPOSE (NPN) TRANSISTOR SURFACE MOUNT PACKAGE

Micropac Industries
Micropac Industries

www.DataSheet.jp    |   2019   |  メール    |   最新    |   Sitemap