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74F133 の電気的特性と機能

74F133のメーカーはNXP Semiconductorsです、この部品の機能は「13.input NAND Gate」です。


製品の詳細 ( Datasheet PDF )

部品番号 74F133
部品説明 13.input NAND Gate
メーカ NXP Semiconductors
ロゴ NXP Semiconductors ロゴ 




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74F133 Datasheet, 74F133 PDF,ピン配置, 機能
Philips Semiconductors Products
13–input NAND Gate
Product specification
FAST 74F133
FAST Products
PRODUCT SPECIFICATION
TYPE
74F133
ORDERING INFORMATION
DESCRIPTION
16–pin plastic DIP
16–pin plastic SO
TYPICAL PROPAGATION
DELAY
4.0ns
TYPICAL SUPPLY CURRENT
(TOTAL)
2.0 mA
COMMERCIAL RANGE
VCC = 5V ±10%,
Tamb = 0°C to +70°C
N74F133N
N74F133D
ORDER CODE
INDUSTRIAL RANGE
VCC = 5V ±10%,
Tamb = –40°C to +85°C
I74F133N
I74F133D
INPUT AND OUTPUT LOADNG AND FAN OUT TABLE
PINS
DESCRIPTION
DO - D12
Data inputs
Q Data output
Note to input and output loading and fan out table
1. One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.
74F (U.L.)
HIGH/LOW
1.0/1.0
50/33
LOAD VALUE
HIGH/LOW
20µA/0.6mA
1.0mA/20mA
PIN CONFIGURATION
LOGIC SYMBOL
LOGIC SYMBOL (IEEE/IEC)
D0
D1
D2
D3
D4
D5
D6
GND
1
2
3
4
5
6
7
8
16 VCC
15 D12
14 D11
13 D10
12 D9
11 D8
10 D7
9Q
1
2
3
4
5
6
7
10
11
12
13
14
15
VCC = Pin 16
GND = Pin 8
9
1
2&
3
4
5
6
7
10
11
12
13
14
15
July 2, 1993
1
853-10219

1 Page





74F133 pdf, ピン配列
Philips Semiconductors Products
13–input NAND Gate
Product specification
FAST 74F133
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
VIN
IIN
VOUT
Supply voltage
Input voltage
Input current
Voltage applied to output in high output state
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
–0.5 to VCC
V
V
mA
V
IOUT
Current applied to output in low output state
40 mA
Tamb
Operating free air temperature range
Commercial range
Industrial range
0 to +70
–40 to +85
°C
°C
Tstg Storage temperature range
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
VIH
VIL
IIk
IOH
IOL
Tamb
Supply voltage
High–level input voltage
Low–level input voltage
Input clamp current
High–level output current
Low–level output current
Operating free air temperature range
MIN
4.5
2.0
Commercial range
Industrial range
0
–40
LIMITS
NOM
5.0
MAX
5.5
0.8
–18
–1
20
+70
+85
UNIT
V
V
V
mA
mA
mA
°C
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS
UNIT
MIN TYP2 MAX
VOH High-level output voltage
VCC = MIN, VIL = MAX
±10%VCC
2.5
V
VIH = MIN, IOH = MAX
±5%VCC
2.7
3.4
V
VOL Low-level output voltage
VCC = MIN, VIL = MAX
±10%VCC
0.35 0.50
V
VIH = MIN, IOl = MAX
±5%VCC
0.35 0.50
V
VIK Input clamp voltage
VCC = MIN, II = IIK
-0.73 -1.2
V
II Input current at maximum input voltage VCC = MAX, VI = 7.0V
100 µA
IIH High–level input current
VCC = MAX, VI = 2.7V
20 µA
IIL Low–level input current
IOS Short-circuit output current3
VCC = MAX, VI = 0.5V
VCC = MAX
-0.6 mA
-60 -150 mA
ICC Supply current (total)
ICCH VCC = MAX
1.0 2.0 mA
ICCL VCC = MAX
2.5 4.0 mA
NOTES:
1.. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3.. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
July 2, 1993
3


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