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PDF 5962F9676701VPA Data sheet ( Hoja de datos )

Número de pieza 5962F9676701VPA
Descripción Radiation Hardened/ High Speed/ Low Power Current Feedback Amplifier with Programmable Output Limiting
Fabricantes Intersil Corporation 
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Data Sheet
HS-1135RH
August 1999 File Number 4099.2
Radiation Hardened, High Speed, Low
Power Current Feedback Amplifier with
Programmable Output Limiting
The HS-1135RH is a radiation hardened, high speed, low
power current feedback amplifier built with Intersil’s
proprietary complementary bipolar UHF-1 (DI bonded wafer)
process. They are QML approved and processed in full
compliance with MIL-PRF-38535. This amplifier features
user programmable output limiting, via the VH and VL pins.
The HS-1135RH is the ideal choice for high speed, low
power applications requiring output limiting (e.g., flash A/D
drivers), especially those requiring fast overdrive recovery
times. The limiting function allows the designer to set the
maximum and minimum output levels to protect downstream
stages from damage or input saturation. The sub-
nanosecond overdrive recovery time ensures a quick return
to linear operation following an overdrive condition.
Component and composite video systems also benefit from
this op amp’s performance, as indicated by the gain flatness,
and differential gain and phase specifications.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96767. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/space.htm
Ordering Information
ORDERING NUMBER
INTERNAL
MKT. NUMBER
TEMP. RANGE
(oC)
5962F9676701VPA
HS7-1135RH-Q
-55 to 125
5962F9676701VPC
HS7B-1135RH-Q
-55 to 125
HS7-1135RH/PROTO HS7-1135RH/PROTO -55 to 125
Features
• Electrically Screened to SMD # 5962-96767
• QML Qualified per MIL-PRF-38535 Requirements
• User Programmable Output Voltage Limiting
• Fast Overdrive Recovery . . . . . . . . . . . . . . . . . <1ns (Typ)
• Low Supply Current . . . . . . . . . . . . . . . . . . . . 6.9mA (Typ)
• Wide -3dB Bandwidth. . . . . . . . . . . . . . . . . .360MHz (Typ)
• High Slew Rate. . . . . . . . . . . . . . . . . . . . . .1200V/µs (Typ)
• High Input Impedance . . . . . . . . . . . . . . . . . . . 2M(Typ)
• Excellent Gain Flatness (to 50MHz). . . . . . ±0.07dB (Typ)
• Total Gamma Dose. . . . . . . . . . . . . . . . . . . . 300kRAD(Si)
• Latch Up . . . . . . . . . . . . . . . . . . . . . None (DI Technology)
Applications
• Flash A/D Driver
• Video Switching and Routing
• Pulse and Video Amplifiers
• Wideband Amplifiers
• RF/IF Signal Processing
• Imaging Systems
Pinout
HS-1135RH
GDIP1-T8 (CERDIP)
OR CDIP2-TI (SBDIP)
TOP VIEW
NC 1
-IN 2
+IN 3
V- 4
-
+
8 VH
7 V+
6 OUT
5 VL
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999

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5962F9676701VPA pdf
Die Characteristics
DIE DIMENSIONS:
59 mils x 58.2 mils x 19 mils ±1 mil
1500µm x 1480µm x 483µm ±25.4µm
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
Top Metallization:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
-IN
HS-1135RH
Substrate:
UHF-1, Bonded Wafer, DI
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Floating
ADDITIONAL INFORMATION:
Worst Case Current Density:
< 2 x 105A/cm2
Transistor Count:
89
HS-1135RH
VH
V+
OUT
+IN
V- VL
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
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