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E208931_HSC278 の電気的特性と機能

E208931_HSC278のメーカーはHitachi Semiconductorです、この部品の機能は「Silicon Schottky Barrier Diode」です。


製品の詳細 ( Datasheet PDF )

部品番号 E208931_HSC278
部品説明 Silicon Schottky Barrier Diode
メーカ Hitachi Semiconductor
ロゴ Hitachi Semiconductor ロゴ 




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E208931_HSC278 Datasheet, E208931_HSC278 PDF,ピン配置, 機能
To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003

1 Page





E208931_HSC278 pdf, ピン配列
HSC278
Silicon Schottky Barrier Diode
ADE-208-931B (Z)
Rev. 2
Dec. 2000
Features
Low forward voltage, Low capacitance.
Ultra small Flat Package (UFP) is suitable for surface mount design.
Ordering Information
Type No.
HSC278
Laser Mark
S6
Package Code
UFP
Pin Arrangement
Cathode mark
Mark
1 S6 2
1. Cathode
2. Anode


3Pages


E208931_HSC278 電子部品, 半導体
HSC278
Package Dimensions
1.2 ± 0.10
1.6 ± 0.10
Unit: mm
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
UFP
Conforms
0.0016 g
Rev.2, Dec. 2000, page 4 of 5

6 Page



ページ 合計 : 7 ページ
 
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[ E208931_HSC278 データシート.PDF ]


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共有リンク

Link :


部品番号部品説明メーカ
E208931_HSC278

Silicon Schottky Barrier Diode

Hitachi Semiconductor
Hitachi Semiconductor


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