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E208931_HSC278のメーカーはHitachi Semiconductorです、この部品の機能は「Silicon Schottky Barrier Diode」です。 |
部品番号 | E208931_HSC278 |
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部品説明 | Silicon Schottky Barrier Diode | ||
メーカ | Hitachi Semiconductor | ||
ロゴ | |||
このページの下部にプレビューとE208931_HSC278ダウンロード(pdfファイル)リンクがあります。 Total 7 pages
To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
1 Page HSC278
Silicon Schottky Barrier Diode
ADE-208-931B (Z)
Rev. 2
Dec. 2000
Features
• Low forward voltage, Low capacitance.
• Ultra small Flat Package (UFP) is suitable for surface mount design.
Ordering Information
Type No.
HSC278
Laser Mark
S6
Package Code
UFP
Pin Arrangement
Cathode mark
Mark
1 S6 2
1. Cathode
2. Anode
3Pages HSC278
Package Dimensions
1.2 ± 0.10
1.6 ± 0.10
Unit: mm
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
UFP
—
Conforms
0.0016 g
Rev.2, Dec. 2000, page 4 of 5
6 Page | |||
ページ | 合計 : 7 ページ | ||
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PDF ダウンロード | [ E208931_HSC278 データシート.PDF ] |
データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。 |
部品番号 | 部品説明 | メーカ |
E208931_HSC278 | Silicon Schottky Barrier Diode | Hitachi Semiconductor |