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DA121TT1 の電気的特性と機能

DA121TT1のメーカーはON Semiconductorです、この部品の機能は「Silicon Switching Diode」です。


製品の詳細 ( Datasheet PDF )

部品番号 DA121TT1
部品説明 Silicon Switching Diode
メーカ ON Semiconductor
ロゴ ON Semiconductor ロゴ 




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DA121TT1 Datasheet, DA121TT1 PDF,ピン配置, 機能
DA121TT1
Preferred Device
Advance Information
Silicon Switching Diode
MAXIMUM RATINGS (TA = 25°C)
Rating
Continuous Reverse Voltage
Recurrent Peak Forward Current
Peak Forward Surge Current
Pulse Width = 10 ms
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR–4 Board (1)
TA = 25°C
Derated above 25°C
Thermal Resistance,
Junction to Ambient (1)
Total Device Dissipation,
FR–4 Board (2)
TA = 25°C
Derated above 25°C
Thermal Resistance,
Junction to Ambient (2)
Junction and Storage
Temperature Range
(1) FR–4 @ Minimum Pad
(2) FR–4 @ 1.0 × 1.0 Inch Pad
Symbol
VR
IF
IFM(surge)
Symbol
PD
RθJA
PD
RθJA
TJ, Tstg
Max
80
200
500
Max
225
1.8
555
360
2.9
345
–55 to
+150
Unit
V
mA
mA
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
http://onsemi.com
3
CATHODE
1
ANODE
3
2
1
CASE 463
SOT–416/SC–75
STYLE 2
DEVICE MARKING
6A
ORDERING INFORMATION
Device
Package
Shipping
DA121TT1
SOT–416 3000 / Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 1
1
Publication Order Number:
DA121TT1/D

1 Page





DA121TT1 pdf, ピン配列
1 ns MAX
10%
90%
VF
100 ns
DA121TT1
t
tif
trr
Irr
500
DUT
DUTY CYCLE = 2%
50
Figure 1. Reverse Recovery Time Equivalent Test Circuit
20 ns MAX
10%
VC
VCM
t
+VCM
Qa
C
500 DUT
BAW62
OSCILLOSCOPE
R 10 M
C 7 pF
D1 243 pF
100 K
DUTY CYCLE = 2%
90%
Vf
400 ns
t
Figure 2. Recovery Charge Equivalent Test Circuit
V
90%
10%
120 ns
V
1 K450
Vfr DUT 50
2 ns MAX
t
DUTY CYCLE = 2%
Figure 3. Forward Recovery Voltage Equivalent Test Circuit
http://onsemi.com
3


3Pages


DA121TT1 電子部品, 半導体
DA121TT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure NO TAG shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 8. Typical Solder Heating Profile
http://onsemi.com
6

6 Page



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部品番号部品説明メーカ
DA121TT1

Silicon Switching Diode

ON Semiconductor
ON Semiconductor


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