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DE28F800B3T150 の電気的特性と機能

DE28F800B3T150のメーカーはIntel Corporationです、この部品の機能は「FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT」です。


製品の詳細 ( Datasheet PDF )

部品番号 DE28F800B3T150
部品説明 FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT
メーカ Intel Corporation
ロゴ Intel Corporation ロゴ 




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DE28F800B3T150 Datasheet, DE28F800B3T150 PDF,ピン配置, 機能
E
PRODUCT PREVIEW
FAST BOOT BLOCK
FLASH MEMORY FAMILY
8 AND 16 MBIT
28F800F3, 28F160F3
Includes Extended and Automotive Temperature Specifications
n High Performance
54 MHz Effective Zero Wait-State
Performance
Synchronous Burst-Mode Reads
Asynchronous Page-Mode Reads
n SmartVoltage Technology
2.7 V3.6 V Read and Write
Operations for Low Power Designs
12 V VPP Fast Factory Programming
n Flexible I/O Voltage
1.65 V I/O Reduces Overall System
Power Consumption
5 V-Safe I/O Enables Interfacing to
5 V Devices
n Enhanced Data Protection
Absolute Write Protection with
VPP = GND
Block Locking
Block Erase/Program Lockout
during Power Transitions
n Density Upgrade Path
8- and 16-Mbit
n Manufactured on ETOX™ V Flash
Technology
n Supports Code Plus Data Storage
Optimized for Flash Data Integrator
(FDI) Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
n Flexible Blocking Architecture
Eight 4-Kword Blocks for Data
32-Kword Main Blocks for Code
Top or Bottom Configurations
Available
n Extended Cycling Capability
Minimum 10,000 Block Erase Cycles
Guaranteed
n Low Power Consumption
Automatic Power Savings Mode
Decreases Power Consumption
n Automated Program and Block Erase
Algorithms
Command User Interface for
Automation
Status Register for System
Feedback
n Industry-Standard Packaging
56-Lead SSOP
µBGA* CSP
Intel’s Fast Boot Block memory family renders high performance asynchronous page-mode and synchronous
burst reads making it an ideal memory solution for burst CPUs. Combining high read performance with the
intrinsic non-volatility of flash memory, this flash memory family eliminates the traditional redundant memory
paradigm of shadowing code from a slow nonvolatile storage source to a faster execution memory for
improved system performance. Therefore, it reduces the total memory requirement which helps increase
reliability and reduce overall system power consumption and cost.
This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. They are available
in industry-standard packages: the µBGA* CSP, ideal for board-constrained applications, and the rugged
56-lead SSOP.
May 1998
Order Number: 290644-001

1 Page





DE28F800B3T150 pdf, ピン配列
E
FAST BOOT BLOCK DATASHEET
CONTENTS
PAGE
1.0 INTRODUCTION .............................................5
1.2 Product Overview.........................................5
2.0 PRODUCT DESCRIPTION..............................6
2.1 Pinouts.........................................................6
2.2 Pin Description.............................................6
2.3 Memory Blocking Organization.....................9
2.3.1 Parameter Blocks ..................................9
2.3.2 Main Blocks ...........................................9
3.0 PRINCIPLES OF OPERATION .....................12
3.1 Bus Operations ..........................................12
3.1.1 Read....................................................12
3.1.2 Output Disable.....................................12
3.1.3 Standby ...............................................12
3.1.4 Write....................................................12
3.1.5 Reset...................................................13
4.0 COMMAND DEFINITIONS ............................13
4.1 Read Array Command................................15
4.2 Read Identifier Codes Command ...............15
4.3 Read Status Register Command................15
4.4 Clear Status Register Command................15
4.5 Block Erase Command ..............................15
4.6 Program Command....................................17
4.7 Block Erase Suspend/Resume Command .17
4.8 Program Suspend/Resume Command.......17
4.9 Set Read Configuration Command.............19
4.9.1 Read Configuration..............................19
4.9.2 Frequency Configuration .....................20
4.9.3 Data Output Configuration ...................20
4.9.4 WAIT# Configuration ...........................20
4.9.5 Burst Sequence...................................20
4.9.6 Clock Configuration .............................20
4.9.7 Burst Length ........................................20
PAGE
5.0 DATA PROTECTION.....................................26
5.1 VPP = VIL for Complete Protection ..............26
5.2 WP# = VIL for Block Locking ......................26
5.3 WP# = VIH for Block Unlocking...................26
6.0 VPP VOLTAGES ............................................26
7.0 POWER CONSUMPTION..............................26
7.1 Active Power ..............................................26
7.2 Automatic Power Savings ..........................26
7.3 Standby Power...........................................27
7.4 Power-Up/Down Operation.........................27
7.4.1 RST# Connection ................................27
7.4.2 VCC, VPP and RST# Transitions ...........27
7.5 Power Supply Decoupling ..........................27
7.5.1 VPP Trace on Printed Circuit Boards ....27
8.0 ELECTRICAL SPECIFICATIONS .................28
8.1 Absolute Maximum Ratings........................28
8.2 Extended Temperature Operating
Conditions .................................................28
8.3 Capacitance ...............................................29
8.4 DC Characteristics—Extended
Temperature..............................................30
8.5 AC Characteristics—Read-Only
Operations—Extended Temperature .........32
8.6 AC Characteristics—Write Operations—
Extended Temperature..............................38
8.7 AC Characteristics—Reset Operation—
Extended Temperature..............................40
8.8 Extended Temperature Block Erase and
Program Performance ...............................41
8.9 Automotive Temperature Operating
Conditions .................................................41
PRODUCT PREVIEW
3


3Pages


DE28F800B3T150 電子部品, 半導体
FAST BOOT BLOCK DATASHEET
E
2.0 PRODUCT DESCRIPTION
This section describes the pinout and block
architecture of the device family.
to the 16-Mbit density. The family is available in
µBGA CSP and 56-lead SSOP packages. Pinouts
for the 8- and 16-Mbit components are illustrated in
Figures 1 and 2.
2.1 Pinouts
Intel’s Fast Boot Block flash memory family
provides upgrade paths in each package pinout up
2.2 Pin Description
The pin description table describes pin usage.
1 2 3 4 5 6 7 8 9 10
A
A15 A12
GND CLK VCC VPP
A4 A1
B 32M 16M
A14
A11
A8
A20 ADV# WE# A19
A17
A5
A2
C 64M
A13 A10 A9 A21 RST# WP# A18 A7 A6 A3
D
VCCQ DQ7 DQ13 DQ12 DQ4 DQ11 DQ10 DQ9 DQ0 CE#
E
A16 DQ15 DQ6 DQ5 VCC DQ3 DQ2 DQ1 OE#
A0
F
WAIT# GND DQ14 GND
VCCQ DQ8 GND
NOTES:
1. Shaded connections indicate upgrade address connections. Lower density devices will not have upper address solder
balls. Routing is not recommended in this area.
2. A20 and A21 are the upgrade address for potential 32-Mbit and 64-Mbit devices (currently not on road map).
3. Reference the Micro Ball Grid Array Package Mechanical Specification and Media Information on Intel’s World Wide Web
home page for detailed package specifications.
Figure 1. 56-Ball µBGA* Package Pinout (Top View, Ball Down)
6 PRODUCT PREVIEW

6 Page



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部品番号部品説明メーカ
DE28F800B3T150

FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT

Intel Corporation
Intel Corporation


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