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PDF HLMP-Q400 Data sheet ( Hoja de datos )

Número de pieza HLMP-Q400
Descripción Subminiature LED Lamps
Fabricantes Agilent(Hewlett-Packard) 
Logotipo Agilent(Hewlett-Packard) Logotipo



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No Preview Available ! HLMP-Q400 Hoja de datos, Descripción, Manual

Subminiature LED Lamps
Technical Data
H
HLMP-PXXX Series
HLMP-QXXX Series
HLMP-6XXX Series
HLMP-70XX Series
Features
• Subminiature Flat Top
Package
Ideal for Backlighting and
Light Piping Applications
• Subminiature Dome
Package
Diffused Dome for Wide
Viewing Angle
Nondiffused Dome for High
Brightness
• Arrays
• TTL and LSTTL
Compatible 5 Volt Resistor
Lamps
• Available in Six Colors
• Ideal for Space Limited
Applications
• Axial Leads
• Available with Lead
Configurations for Surface
Mount and Through Hole
PC Board Mounting
Description
Flat Top Package
The HLMP-PXXX Series flat top
lamps use an untinted, non-
diffused, truncated lens to
provide a wide radiation pattern
that is necessary for use in
backlighting applications. The
flat top lamps are also ideal for
use as emitters in light pipe
applications.
Dome Packages
The HLMP-6XXX Series dome
lamps for use as indicators use
a tinted, diffused lens to provide
a wide viewing angle with a
high on-off contrast ratio. High
brightness lamps use an
untinted, nondiffused lens to
provide a high luminous
intensity within a narrow
radiation pattern.
Arrays
The HLMP-66XX Series
subminiature lamp arrays are
available in lengths of 3 to 8
elements per array. The
luminous intensity is matched
within an array to assure a 2.1
to 1.0 ratio.
Resistor Lamps
The HLMP-6XXX Series 5 volt
subminiature lamps with built
in current limiting resistors are
for use in applications where
space is at a premium.
Lead Configurations
All of these devices are made by
encapsulating LED chips on
axial lead frames to form molded
epoxy subminiature lamp
packages. A variety of package
configuration options is avail-
able. These include special
surface mount lead configura-
tions, gull wing, yoke lead or Z-
bend. Right angle lead bends at
2.54 mm (0.100 inch) and
5.08 mm (0.200 inch) center
spacing are available for
through hole mounting. For
more information refer to
Standard SMT and Through
Hole Lead Bend Options for
Subminiature LED Lamps data
sheet.
1-174
5964-9350E

1 page




HLMP-Q400 pdf
Electrical/Optical Characteristics, TA = 25°C
Standard Red
Device
HLMP-
Parameter
Symbol Min. Typ. Max. Units Test Conditions
6000
0.5 1.2
6001
6203 to
6208
Luminous Intensity[1]
Iv 1.3 3.2
0.5 1.2
mcd IF = 10 mA
Forward Voltage
All Reverse Breakdown
Voltage
VF
1.4 1.6 2.0
V IF = 10 mA
VR 5.0 12.0
V IR = 100 µA
P005
All
Others
Included Angle Between
Half Intensity Points[2]
2θ1/2
125
Deg.
90
Peak Wavelength
λPEAK
Dominant Wavelength[3]
λd
Spectral Line Half Width ∆λ1/2
All Speed of Response
τs
Capacitance
C
Thermal Resistance
RθJ-PIN
655 nm
640 nm
24 nm
15 ns
100 pF VF = 0; f = 1 MHz
170 °C/W Junction-to-Cathode
Lead
Luminous Efficacy[4]
ηv
65 lm/W
1-178

5 Page





HLMP-Q400 arduino
Emerald Green[1]
Device
HLMP-
P605
Q600
P605
Q600
P605/
Q600
Parameter
Luminous Intensity
Forward Voltage
Reverse Breakdown
Voltage
Included Angle Between
Half Intensity Points[2]
Peak Wavelength
Dominant Wavelength[3]
Spectral Line Half Width
Speed of Response
Capacitance
Thermal Resistance
Luminous Efficacy[4]
Symbol
Iv
VF
V
R
2θ1/2
λPEAK
λd
∆λ1/2
τs
C
RθJ-PIN
ηv
Min.
1.0
1.0
5.0
Typ. Max. Units
1.5 mcd
1.5
2.2 3.0 V
V
125
90
558
560
24
3100
35
170
Deg.
nm
nm
nm
ns
pF
°C/W
656 lm/W
Test Conditions
IF = 10 mA
IF = 10 mA
I
R
=
100
µA
Measured at Peak
VF = 0; f = 1 MHz
Junction-to-Cathode
Lead
Note:
1. Please refer to Application Note 1061 for information comparing stnadard green and emerald green light ouptut degradation.
1-184

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