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Datasheet HSMF-C655 PDF ( 特性, スペック, ピン接続図 )

部品番号 HSMF-C655
部品説明 Surface Mount Chip LEDs
メーカ Agilent(Hewlett-Packard)
ロゴ Agilent(Hewlett-Packard) ロゴ 
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HSMF-C655 Datasheet, HSMF-C655 PDF,ピン配置, 機能
Surface Mount Chip LEDs
Technical Data
H
HSMX-C650
HSMX-C670
HSMF-C655
Features
• Small Size
• Industry Standard
Footprint
• Low Profile
• Tinted, Diffused Optics
• Compatible with IR Solder
Process
• Five Colors and Bicolor
Available
• Available in 8 mm Tape on
7" (178 mm) Diameter
Reels
Device Selection Guide
Applications
• Push-Button Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
These single and bicolor LEDs
are designed in an industry
standard package for ease of
handling and use. Five different
LED colors are available in two
compact, low profile, single color
packages. The 3.2 x 1.6 mm is
an excellent all around package,
and the small 2.0 x 1.25 mm
package is designed for applica-
tions where space is limited.
The single color LEDs have
tinted diffused optics. The
bicolor package is untinted,
diffused.
The small size, low 1.1 mm
profile and wide viewing angle
make these LEDs excellent for
backlighting applications and
front panel illumination. They
are compatible with IR reflow
soldering processes.
Footprint
(mm)
3.20 x 1.60
2.00 x 1.25
3.20 x 2.70
DH
AlGaAs
Red
High
Efficiency
Red
Orange
Yellow
Green
Bicolor
HER-
Green
HSMH-C650 HSMS-C650 HSMD-C650 HSMY-C650 HSMG-C650
HSMH-C670 HSMS-C670 HSMD-C670 HSMY-C670 HSMG-C670
HSMF-C655
1-212
5964-9360E

1 Page



HSMF-C655 pdf, ピン配列
Absolute Maximum Ratings at TA = 25°C
Parameter
HSMX-C650
HSMF-C655
HSMX-C670
Units
DC Forward Current[1]
25 20 mA
Power Dissipation
65 50 mW
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
5
95
5V
95 °C
Operating Temperature Range
-25 to +80
-25 to +80
°C
Storage Temperature Range
-30 to +85
-30 to +85
°C
Soldering Temperature
See SMT reflow soldering profile, Figure 6
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
Optical Characteristics at TA = 25°C
Part
Number
Color
Luminous
Intensity
IV (mcd)
@ IF 20 mA[1]
Min. Typ.
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees[3]
Typ.
HSMH-C650 DH AlGaAs Red
HSMH-C670
6.3 16.0
650
639 155
HSMS-C650 High Efficiency 1.6 5.0
HSMS-C670
Red
639
626 155
HSMD-C650
HSMD-C670
Orange
1.6 4.0
606
604 155
HSMY-C650
HSMY-C670
Yellow
1.6 5.0
584
586 155
HSMG-C650
HSMG-C670
Green
4.0 9.0
566
571 155
HSMF-C655 High Efficiency 1.6 5.0
Red
639
626 155
Green
4.0 9.0
566
571 155
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the
mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. Chip LEDs are supplied in 8 mm embossed tape on 178 mm (7 in.) diameter reels, with 3000 devices per reel. Minimum order
quantity and order incremenets are in quantity of reels only.
1-214


3Pages


HSMF-C655 電子部品, 半導体
10 SEC. MAX.
230°C MAX.
140-160°C
4°C/SEC. MAX.
OVER 2 MIN. .
TIME
4°C/SEC. MAX.
-3°C/SEC. MAX.
Figure 6. Recommended SMT Reflow
Soldering Profile.
USER FEED DIRECTION
1.50 (0.059)
1.75 2.0 1.75
(0.069) (0.079) (0.069)
HSMX-C650 SERIES
1.75 2.0 1.75
(0.069) (0.079) (0.069)
HSMF-C655 SERIES
1.0 (0.039)
1.0 (0.039)
0.4
(0.016)
1.25
(0.049)
1.25
(0.049)
1.1
(0.043)
HSMX-C670 SERIES
1.1 (0.043)
Figure 7. Recommended Solder Patterns.
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling Orientation.
NOTE:
ALL DIMENSIONS IN MILLIMETERS (INCHES).
2.0
(0.08)
21.0
(0.83)
LABEL
Ø1(77.80.10)
Ø(38.01.50)
Ø13.0
(0.51)
60°
60°
1.5
(0.06)
TYP.
Figure 9. Reel Dimensions.
13.0
(0.51)
10.0
(0.39)
1-217

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